ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE
First Claim
1. An ultrasound acoustic assembly comprising:
- a plurality of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer, wherein the acoustic stack defines a plurality of dicing kerfs and a plurality of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements, and wherein the dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer; and
a plurality of application specific integrated circuit (ASIC) die, wherein each ultrasound acoustic array is coupled to a respective one of the ASIC die to form a respective acoustic-electric transducer module.
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Accused Products
Abstract
An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
19 Citations
25 Claims
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1. An ultrasound acoustic assembly comprising:
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a plurality of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer, wherein the acoustic stack defines a plurality of dicing kerfs and a plurality of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements, and wherein the dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer; and a plurality of application specific integrated circuit (ASIC) die, wherein each ultrasound acoustic array is coupled to a respective one of the ASIC die to form a respective acoustic-electric transducer module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 12)
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9. A method of manufacturing an ultrasound acoustic assembly, the method comprising:
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assembling a piezoelectric layer with at least one acoustic impedance dematching layer and with a support layer to form an acoustic stack; dicing the acoustic stack to form a plurality of acoustic elements, such that a plurality of dicing kerfs are formed between neighboring ones of the acoustic elements, wherein the dicing kerfs extend only partially through the support layer; and connecting each of the diced, acoustic stacks to a respective one of a plurality of application specific integrated circuit (ASIC) die, to form a respective acoustic-electric transducer module. - View Dependent Claims (10, 11, 13, 14, 15, 16, 17)
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18. A method of manufacturing an ultrasound acoustic assembly, the manufacturing method comprising:
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depositing an under-bump metallization (UBM) on a plurality of acoustic impedance dematching regions; disposing a plurality of conductive bumps on a substrate or on a plurality of application specific integrated circuit (ASIC) die; disposing the acoustic impedance dematching regions on the substrate or on the ASIC die, wherein the conductive bumps are disposed between the acoustic impedance dematching regions and substrate or ASIC die; performing a reflow operation, such that a plurality of uniform electrical connections are formed between the acoustic impedance dematching regions and the respective ASIC die or substrate; and disposing at least one piezoelectric region on the acoustic impedance dematching regions to form respective acoustic stacks. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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Specification