SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a semiconductor chip including a MOSFET and having a first main surface and a second main surface opposite the first main surface, a source electrode pad and a gate electrode pad are formed over the first main surface, a drain electrode is formed over the second main surface;
a source external terminal having a first main surface electrically connected to the source electrode pad of the semiconductor chip and a second main surface opposite the first main surface;
a gate external terminal having a first main surface electrically connected to the gate electrode pad of the semiconductor chip and a second main surface opposite the first main surface; and
a drain external terminal having a first main surface and a second main surface opposite the first main surface and being electrically connected to the second main surface of the semiconductor chip,wherein each of the second main surfaces of the source, gate, and drain external terminals is in a same plane, andwherein, in a second main surface view of each of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction.
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Accused Products
Abstract
A semiconductor device featuring a semiconductor chip including a MOSFET and having a first main surface and a second, opposing main surface, a source electrode pad and a gate electrode pad over the first main surface, a drain electrode over the second main surface, a source external terminal and a gate external terminal, each having a first main surface electrically connected to the source electrode pad and gate electrode pad of the chip, respectively, and a drain external terminal having a first main surface and a second, opposing main surface and being electrically connected to the second main surface of the chip, each of the source, gate and drain external terminals having second main surfaces thereof in a same plane, and, in a plan view of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction.
3 Citations
7 Claims
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1. A semiconductor device comprising:
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a semiconductor chip including a MOSFET and having a first main surface and a second main surface opposite the first main surface, a source electrode pad and a gate electrode pad are formed over the first main surface, a drain electrode is formed over the second main surface; a source external terminal having a first main surface electrically connected to the source electrode pad of the semiconductor chip and a second main surface opposite the first main surface; a gate external terminal having a first main surface electrically connected to the gate electrode pad of the semiconductor chip and a second main surface opposite the first main surface; and a drain external terminal having a first main surface and a second main surface opposite the first main surface and being electrically connected to the second main surface of the semiconductor chip, wherein each of the second main surfaces of the source, gate, and drain external terminals is in a same plane, and wherein, in a second main surface view of each of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification