Semiconductor Module With a Semiconductor Chip and a Passive Component and Method for Producing the Same
First Claim
1. A semiconductor module comprising:
- a semiconductor chip including;
a control electrode disposed on a portion of an external face of the semiconductor chip, anda contact having a two-dimensional extent that substantially covers a remaining portion of the external face; and
a passive discrete component arranged in a package and stacked on the contact, the passive discrete component comprising;
an electrode having a side that contacts the contact of the semiconductor chip such that the electrode is electrically connected to and fixed on the contact, anda counter electrode electrically connected to the control electrode of the semiconductor chip.
1 Assignment
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Accused Products
Abstract
A semiconductor module includes a semiconductor chip and a passive discrete component. The semiconductor chip includes on its top side and/or on the back side one or more contacts, which in its two-dimensional extent takes up the top side and/or the back side of the semiconductor chip virtually completely. The passive component, arranged in a package, is stacked on one of the contacts. The electrode of the passive component is electrically connected with one of the contacts. The counter electrode of the passive component is operatively connected with a control or signal electrode of the semiconductor chip or an electrode of a further semiconductor chip.
6 Citations
20 Claims
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1. A semiconductor module comprising:
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a semiconductor chip including; a control electrode disposed on a portion of an external face of the semiconductor chip, and a contact having a two-dimensional extent that substantially covers a remaining portion of the external face; and a passive discrete component arranged in a package and stacked on the contact, the passive discrete component comprising; an electrode having a side that contacts the contact of the semiconductor chip such that the electrode is electrically connected to and fixed on the contact, and a counter electrode electrically connected to the control electrode of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor module comprising:
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a semiconductor chip defining a first surface and a second surface, the semiconductor chip including; a control electrode disposed on the first surface of the semiconductor chip, the control electrode covering a portion of the first surface, and a contact disposed on the first surface of the semiconductor chip, the contact substantially covering a remaining portion of the first surface; and a passive discrete component arranged in a package and stacked on the contact, the passive discrete component comprising; an electrode electrically connected to and fixed on the contact of the semiconductor chip, and a counter electrode electrically connected to and fixed on the control electrode of the semiconductor chip. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A semiconductor module comprising:
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a chip pad; a power semiconductor chip having a top side and a back side opposite the top side, the back side facing the chip pad, the power semiconductor including; a first contact that emits signals, and a second contact for carrying current; and a passive discrete component arranged on the first contact, the passive discrete component comprising; an electrode arranged on the second contact of the semiconductor chip, and a counter electrode arranged on the first contact control of the semiconductor chip. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification