Smart Package and Monitoring System with Indicator and Method of Making Same
First Claim
1. A smart package monitoring system comprising:
- an electronic sensor monitoring tag having re-usable electronic circuitry and power source;
a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device; and
an optical ink indicator configured to display the status of the package.
2 Assignments
0 Petitions
Accused Products
Abstract
There is provided a smart package and monitoring system having a status indicator and a method of making the same. The smart package includes an electronic sensor monitoring tag having re-usable electronic circuitry and power source along with a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device. The conductive grid is aligned with an opening of the smart package. The smart package can also include an optical ink indicator configured to display the status of the package. A multiplexer can be used to connect the tag to the conductive grid. The conductive grid can include capacitive sensors formed on a thin plastic layer and positioned so as to form a capacitive element with the conductive side of the blister.
152 Citations
42 Claims
-
1. A smart package monitoring system comprising:
-
an electronic sensor monitoring tag having re-usable electronic circuitry and power source; a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device; and an optical ink indicator configured to display the status of the package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 13, 14, 19, 20, 21, 22, 23, 24, 25, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
-
-
8. A smart package monitoring system comprising:
-
an electronic sensor monitoring tag having re-usable electronic circuitry and power source; a conductive grid printed on a thin flexible substrate; and a multiplexer connecting the tag to the conductive grid so the tag and grid are in electrical continuity to form a monitoring device. - View Dependent Claims (9, 10, 11, 12)
-
-
15. A smart package comprising:
-
a card having product receptacles and a conductive side; an electronic sensor monitoring tag having re-usable electronic circuitry and power source; and a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device; wherein the conductive grid includes capacitive sensors formed with the conductive side of the card as one of the plates of the capacitive sensors; and wherein the conductive grid is aligned with the product receptacles in the card. - View Dependent Claims (16, 17, 18, 26)
-
-
27. A method of forming a conductive grid having a substrate for a smart package comprising the steps of:
releasing conductive material from a continuous roll of conductively coated transfer ribbon onto a surface of the substrate and thereby subtractively forming sensor grids and connection patches to be joined with an electronic tag of the smart package. - View Dependent Claims (28)
Specification