DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME
First Claim
1. A method, comprising:
- forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth;
forming an insulation structure on the silicon substrate along the sidewalls and the bottom of the opening; and
forming a conductive layer on the insulation structure to fill the opening;
wherein a first interface between the insulation structure and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm, and a second interface between the insulation structure and the conductive layer has an interface roughness with a peak-to-valley height less than 5 nm.
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Accused Products
Abstract
A method includes forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth. The method further includes forming an insulation structure on the silicon substrate along the sidewalls and the bottom of the opening and forming a conductive layer on the insulation structure to fill the opening. A first interface between the insulation structure and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm, and a second interface between the insulation structure and the conductive layer has an interface roughness with a peak-to-valley height less than 5 nm.
6 Citations
20 Claims
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1. A method, comprising:
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forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth; forming an insulation structure on the silicon substrate along the sidewalls and the bottom of the opening; and forming a conductive layer on the insulation structure to fill the opening; wherein a first interface between the insulation structure and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm, and a second interface between the insulation structure and the conductive layer has an interface roughness with a peak-to-valley height less than 5 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method, comprising:
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forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth; forming a first insulation layer on the silicon substrate along the sidewalls and the bottom of the opening; performing a thermal oxidation process to form a second insulation layer along the sidewalls and the bottom of the opening; and forming a conductive layer over the second insulation layer to fill the opening; wherein an interface between the first insulation layer or the second insulation layer and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm. - View Dependent Claims (13, 14, 15, 16)
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17. A method, comprising:
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forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth; forming an insulation structure on the silicon substrate along the sidewalls and the bottom of the opening, wherein an interface between the insulation structure layer and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm; forming a conductive layer over the second insulation layer to fill the opening; thinning a bottom surface of the silicon substrate opposite the top surface of the silicon substrate; and bonding at least one die to the thinned silicon substrate. - View Dependent Claims (18, 19, 20)
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Specification