MECHANICAL TESTING INSTRUMENTS INCLUDING ONBOARD DATA

• US 20130332100A1
• Filed: 11/23/2011
• Published: 12/12/2013
• Est. Priority Date: 11/24/2010
• Status: Active Grant

• Current Assignee: Hysitron Incorporated (Bruker Corporation)
• Original Assignee: Hysitron Incorporated (Bruker Corporation)
• Inventors: Keranen, Lucas Paul, Young, Christopher David, Carlson, Daniel Paul, Schirer, Jeffrey P.
• Granted Patent: US 9,194,727 B2
• Time in Patent Office: Days
• US Class Current: 702/105
• CPC Class Codes: B82Y 35/00 Methods or apparatus for measurement or analysis of nanostructures
• CPC Class Codes: G01B 21/042 Calibration or calibration artifacts G01B3/30, G01B9/02072 take precedence
• CPC Class Codes: G01B 5/28 for measuring roughness or irregularity of surfaces
• CPC Class Codes: G01D 18/008 with calibration coefficients stored in memory
• CPC Class Codes: G01N 1/42 Low-temperature sample treatment, e.g. cryofixation
• CPC Class Codes: G01N 2203/0206 Means for supplying or positioning specimens or exchangeable parts of the machine such as indenters...
• CPC Class Codes: G01N 2203/021 Treatment of the signal; Calibration
• CPC Class Codes: G01Q 30/04 Display or data processing devices
• CPC Class Codes: G01Q 40/00 Calibration, e.g. of probes
• CPC Class Codes: G01Q 60/366 Nanoindenters, i.e. wherein the indenting force is measured

Abstract

A method of calibrating a mechanical instrument assembly includes reading a memory device coupled with a mechanical testing instrument, the mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument, and reading includes reading of one or more calibration values based on the one or more mechanical characteristic values. The method further includes calibrating the mechanical instrument assembly according to the one or more calibration values. The mechanical testing instrument is coupled with the mechanical instrument assembly.

Claims

1. A mechanical testing assembly configured for sub-micron scale mechanical testing comprising:

a mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument; and

a memory device incorporated with the mechanical testing instrument, wherein

in a first condition the memory device includes one or more calibration values based on the one or more mechanical characteristic values that are unique to the mechanical testing instrument, and

in a second condition the memory device is configured to include a failure to recognize value that precludes future use of the mechanical testing instrument.

2. The mechanical testing assembly of claim 1, wherein the mechanical testing instrument includes one or more of a probe tip, a transducer assembly and an imaging scanner assembly.

3. The mechanical testing assembly of claim 1, wherein the one or more mechanical characteristics includes a tip shape of a probe tip.

4. The mechanical testing assembly of claim 3, wherein the one or more calibration values includes an area function based on the tip shape.

6. The mechanical testing assembly of claim 1, wherein the mechanical testing instrument includes a transducer assembly and the one or more mechanical characteristics includes a spring constant of a deflectable support element coupled between a transducer and a transducer body.

8. The mechanical testing assembly of claim 1, wherein the mechanical testing instrument includes a transducer and the one or more mechanical characteristics include at least one of transducer capacitor plate area and separation between plates.

9. The mechanical testing assembly of claim 8, wherein the one or more calibration values includes the relation between voltage applied to the transducer and force applied by the transducer.

11. The mechanical testing assembly of claim 1, wherein the mechanical testing instrument includes an imaging scanner assembly including a transducer and the one or more mechanical characteristics include at least one of transducer capacitor plate area and separation between plates of the transducer.

12. The mechanical testing assembly of claim 11, wherein the one or more calibration values includes the relation between x-y lateral displacement of the transducer and voltage change at the transducer.

13. The mechanical testing assembly of claim 11, wherein the one or more calibration values includes the relation between z displacement of the transducer and voltage change at the transducer.

14. The mechanical testing assembly of claim 1 comprising a mechanical instrument assembly, and the mechanical testing instrument is coupled with the mechanical instrument assembly;

wherein the mechanical instrument assembly is configured to read the one or more calibration values and the mechanical instrument assembly is configured for calibration according to the one or more calibration values for sub-micron scale mechanical testing.

15. The mechanical testing assembly of claim 1, wherein the memory device consists essentially of one or more of a radio frequency identification chip, a wired memory chip, an inductive memory chip, a bar code, visual characters capable of optical character recognition.

5. (canceled)

7. (canceled)

10. (canceled)

16. A method of calibrating a mechanical instrument assembly comprising:

reading a memory device incorporated with a mechanical testing instrument, the mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument, and reading includes reading of one or more calibration values based on the one or more mechanical characteristic values;

calibrating the mechanical instrument assembly according to the one or more calibration values;

coupling the mechanical testing instrument with the mechanical instrument assembly;

performing analysis of the mechanical testing instrument to update the values of the one or more mechanical characteristics;

writing over or appending the one or more calibration values on the memory device with updated calibration values based on the updated values of the one or more mechanical characteristics;

comparing the one or more calibration values with one or more threshold values; and

determining the mechanical testing instrument is not suitable for use with the mechanical instrument assembly based on the comparison with of the one or more calibration values with the one or more threshold values.

18. The method of claim 16 comprising:

comparing the updated calibration values with one or more threshold values;

determining the mechanical testing instrument is not suitable for use with the mechanical instrument assembly based on the comparison of the updated calibration values with the one or more threshold values.

19. The method of claim 16, wherein reading the memory device includes reading the memory device with the mechanical instrument assembly, wherein the mechanical instrument assembly is configured to couple with the mechanical testing instrument and operate the mechanical testing instrument.

20. The method of claim 16, wherein reading the memory device incorporated with the mechanical testing instrument includes reading the memory device incorporated with a probe tip, and the one or more mechanical characteristics includes a tip shape of the probe tip.

22. The method of claim 16, wherein calibrating the mechanical instrument assembly according to the one or more calibration values includes calibrating the mechanical instrument assembly according to an area function based on a tip shape, wherein the area function relates an indentation depth with a cross sectional area of a probe tip included with the mechanical testing instrument.

23. The method of claim 16, wherein reading the memory device incorporated with the mechanical testing instrument includes reading the memory device incorporated with a transducer assembly, and the one or more mechanical characteristics includes a spring constant of a deflectable support element coupled between the transducer and a transducer body.

25. The method of claim 23, wherein calibrating the mechanical instrument assembly according to the one or more calibration values includes calibrating the mechanical instrument assembly with the spring constant of the deflectable support element.

26. The method of claim 16, wherein reading the memory device incorporated with the mechanical testing instrument includes reading the memory device incorporated with a transducer assembly, and the one or more mechanical characteristics includes at least one of transducer capacitor plate area and separation between plates of a transducer.

28. The method of claim 26, wherein calibrating the mechanical instrument assembly according to the one or more calibration values includes calibrating the mechanical instrument assembly with a relation between displacement of the transducer and voltage change at the transducer based on one or more of transducer capacitor plate area and separation between plates of the transducer.

29. The method of claim 16, wherein reading the memory device incorporated with the mechanical testing instrument includes reading the memory device incorporated with an imaging scanner assembly, and the one or more mechanical characteristic includes at least one of transducer capacitor plate area and separation between capacitor plates of a transducer.

30. The method of claim 29, wherein calibrating the mechanical instrument assembly according to the one or more calibration values includes calibrating the mechanical instrument assembly with a relation between x-y lateral displacement of the transducer and voltage change at the transducer based on one or more of transducer capacitor plate area and separation between capacitor plates of the transducer.

33. The method of claim 16 comprising:

reading an identification parameter from the memory device incorporated with the mechanical testing instrument;

comparing the identification parameter with an identification threshold; and

precluding operation of a system including the mechanical testing instrument if the identification parameter does not meet the identification threshold.

34. The method of claim 33 comprising writing a failure to recognize value to the memory device incorporated with the mechanical testing instrument.

17. (canceled)

21. (canceled)

24. (canceled)

27. (canceled)

31. (canceled)

32. (canceled)

35. (canceled)