WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

• US 20130333930A1
• Filed: 06/11/2013
• Published: 12/19/2013
• Est. Priority Date: 06/15/2012
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: KOYANAGI, Takaaki
• Granted Patent: US 9,161,453 B2
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/0038 combined with laser drilling through a metal layer
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion.

Claims

1. A wiring board comprising:

a core layer;

a through hole penetrating through the core layer in a thickness direction of the core layer; and

an electronic part accommodated inside the through hole,

wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and

wherein the electronic part is held by the inward protruding portion.

2. The wiring board according to claim 1,

wherein the inward protruding portion is positioned on an inner wall surface of the through hole in a middle of the core layer in the thickness direction.

3. The wiring board according to claim 1,

wherein the inward protruding portion is shaped like a ring, and

the inward protruding portion contacts a side surface of the electronic part.

4. The wiring board according to claim 1,

wherein the through hole includes

a first hole including the first opening portion and a first apex portion, a cross-sectional area of the first hole being continuously reduced from an area of the first opening portion to an area of the first apex portion along a thickness direction of the core layer, and

a second hole including the second opening portion and a second apex portion, a cross-sectional area of the second hole being continuously reduced from an area of the second opening portion to an area of the second apex portion along a thickness direction of the core layer,

wherein the first apex portion is connected to the second apex portion to form the inward protruding portion having a smallest area in the cross-sectional area of the through hole.

5. The wiring board according to claim 1,

wherein an insulating layer and a wiring layer are sequentially laminated on the first surface of the core layer, and

the wiring layer includes a wiring pattern formed on a first surface of the insulating layer and via wiring, which is formed inside the insulating layer and electrically connected to an electrode of the electronic part.

6. The wiring board according to claim 5,

wherein another insulating layer and another wiring layer are sequentially laminated on the second surface of the core layer, and

the other wiring layer includes another wiring pattern formed on a second surface of the other insulating layer and another via wiring, which is formed inside the other insulating layer and electrically connected to the electrode of the electronic part.

7. The wiring board according to claim 6,

wherein a resin part fills a periphery of the electronic part inside the through hole,

the insulating layer coats the resin part,

the other insulating layer coats the resin part,

the electrode is directly electrically connected to the via wiring, and

the electrode is directly electrically connected to the other via wiring.

8. A method of manufacturing a wiring board comprising:

forming a through hole penetrating through a core layer in a thickness direction of the core layer, the through hole including a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion whose inner wall surface inwardly protrudes relative to the first and second opening portions;

provisionally arranging an electronic part on the inward protruding portion inside the through hole; and

causing the electronic part to be held inside the inward protruding portion by pressing the electronic part toward the inward protruding portion.

9. The method of manufacturing the wiring board according to claim 8,

wherein the forming the through hole forms the inward protruding portion to be in a ring-like shape,

in the causing the electronic part to be held, a side surface of the electronic part contacts the inward protruding portion.

10. The method of manufacturing the wiring board according to claim 9,

wherein, in the forming the through hole, planar shapes of the first and second opening portions of the through hole are greater than a planar shape of the electronic part, and a planar shape of an inside area of the inward protruding portion is smaller than the planar shape of the electronic part,

in the causing the electronic part to be held, the inward protruding portion deforms by pressing the electronic part toward the inward protruding portion so that the side surface of the electronic part contacts the inward protruding portion.

11. The method of manufacturing the wiring board according to claim 8,

wherein the forming the through hole includes

preparing a laminated plate including the core layer having a first metallic foil on the first surface of the core layer and a second metallic foil on the second surface of the core layer,

forming a first hole by irradiating the first metallic foil and the core layer with an ultraviolet laser beam, the first hole including the first opening portion having a greatest area in a cross-sectional area of the first hole, and

forming a second hole by irradiating the second metallic foil and the core layer with an ultraviolet laser beam, the second hole including the second opening portion having a greatest area in a cross-sectional area of the second hole so that the inward protruding portion is formed at a portion connecting the first hole and the second hole.