DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING

  • US 20140008809A1
  • Filed: 09/12/2013
  • Published: 01/09/2014
  • Est. Priority Date: 12/30/2011
  • Status: Active Grant
First Claim
Patent Images

1. A method of making a semiconductor package, comprising:

  • placing a plurality of die units face up on a carrier, each die unit having an active front surface oriented away from the carrier and a back surface opposing the active front surface, the active front surface and the back surface joined by at least four side surfaces;

    forming at least one conductive interconnect coupled to each of the plurality of die units; and

    encapsulating the plurality of die units and the at least one conductive interconnects with an encapsulant that covers the active front surface and the at least four side surfaces of each of the plurality of die units.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×