WIRELESS POWER TRANSFER DEVICES

• US 20140021794A1
• Filed: 12/18/2012
• Published: 01/23/2014
• Est. Priority Date: 07/17/2012
• Status: Abandoned Application

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: KIM, Yong Hae, CHEON, Sang Hoon, KANG, Seung Youl, LEE, Myung Lae, ZYUNG, Taehyoung
• Application Number:
  US13/717,798
• Publication Number:
  US 20140021794A1
• Time in Patent Office: Days
• US Class Current: 307/104
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/006 with special arrangement or spacing of turns of the winding(s), e.g. to produce desired self-resonance
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10

Abstract

Wireless power transfer devices are provided. The wireless power transfer device may include a plurality of stacked resonance structures, and adhesive layers between the resonance structures. Each of the resonance structures includes a base board including a base coil, interposer boards including interposer coils and stacked on the base board, and conductive pillars penetrating the base board and the interposer board. The conductive pillars connect the interposer boards to each other.

Claims

1. A wireless power transfer device comprising:

a plurality of stacked resonance structures; and

adhesive layers between the resonance structures,

wherein each of the resonance structures includes a base board including a base coil, interposer boards including interposer coils and stacked on the base board, and conductive pillars penetrating the base board and the interposer board; and

wherein the conductive pillars connect the interposer boards to each other.

2. The wireless power transfer device of claim 1, wherein a length of one side of each of the resonance structures is about 5 cm.

3. The wireless power transfer device of claim 1, wherein a total stack number of the base board and the interposer boards is eight in each of the resonance structures.

4. The wireless power transfer device of claim 1, wherein each of the resonance structures has a thickness of about 0.73 mm.

5. The wireless power transfer device of claim 1, wherein each of the adhesive layers has a thickness of about 0.05 mm.

6. The wireless power transfer device of claim 1, wherein the base coil includes a base induction coil and a base resonance coil;

wherein each of the base induction coil and the base resonance coil extends in a first rotation direction; and

wherein a turn number of the base resonance coil is greater than a turn number of the base induction coil.

7. The wireless power transfer device of claim 1, wherein the interposer boards include first interposer boards and second interposer boards which are alternately stacked;

wherein each of the first interposer boards includes a first interposer induction coil and a first interposer resonance coil; and

wherein each of the second interposer boards includes a second interposer induction coil and a second interposer resonance coil.

8. The wireless power transfer device of claim 7, wherein a turn number of the first interposer induction coil is equal to a turn number of the second interposer induction coil.

9. The wireless power transfer device of claim 7, wherein a turn number of the first interposer resonance coil is greater than a turn number of the first interposer induction coil;

and

wherein a turn number of the second interposer resonance coil is greater than a turn number of the second interposer induction coil.

10. The wireless power transfer device of claim 7, wherein the first interposer resonance coil extends in a first rotation direction;

and

wherein the second interposer resonance coil extends in a second rotation direction opposite to the first rotation direction.

11. The wireless power transfer device of claim 7, wherein the conductive pillars includes a first conductive pillar, a second conductive pillar, a third conductive pillar, and a fourth conductive pillar;

wherein the first conductive pillar connects first ends of the base induction coil, the first interposer induction coils, and the second interposer induction coils to each other;

wherein the second conductive pillar connects second ends of the base induction coil, the first interposer induction coils, and the second interposer induction coils to each other;

wherein the third conductive pillar connects one-end of the base resonance coil and one-ends of the second interposer resonance coils to each other; and

wherein the fourth conductive pillar connects one-ends of the first interposer resonance coils to each other.

12. The wireless power transfer device of claim 1, wherein each of the base board and the interposer boards is formed of a printed circuit board.

13. The wireless power transfer device of claim 1, further comprising:

an inductance structure bonded to an uppermost layer or a lowermost layer of the resonance structures.

14. The wireless power transfer device of claim 13, wherein the inductance structure includes inductance boards and conduction board which are stacked;

and

wherein the inductance boards include inductance coils and the conduction boards includes conduction coil in, respectively.

15. The wireless power transfer device of claim 14, wherein the inductance structure further includes a first inductance conductive pillar connecting first ends of the inductance coils to each other, and a second inductance conductive pillar connecting second ends of the inductance coils to each other.

16. The wireless power transfer device of claim 13, wherein a length of one side of the inductance structure is about 5 cm.