SINGLE-LAYER METALIZATION AND VIA-LESS METAMATERIAL STRUCTURES
2 Assignments
0 Petitions
Accused Products
Abstract
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
7 Citations
103 Claims
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1-39. -39. (canceled)
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40. A metamaterial device, comprising:
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a dielectric substrate having a first surface and a second, different surface; a first metallization layer formed on the first surface; and a second metallization layer formed on the second surface, wherein the first and second metallization layers are patterned to have two or more conductive parts including a cell patch on the first metallization layer to form a composite left and right handed (CRLH) metamaterial structure that comprises a unit cell which is free of a conductive via penetrating the dielectric substrate to connect the first metallization layer and the second metallization layer, and wherein the second metallization layer includes a bottom ground electrode located outside a footprint of the cell patch. - View Dependent Claims (79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103)
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41-78. -78. (canceled)
Specification