ANCHOR DESIGN AND METHOD FOR MEMS TRANSDUCER APPARATUSES

• US 20140024162A1
• Filed: 09/18/2013
• Published: 01/23/2014
• Est. Priority Date: 08/19/2010
• Status: Active Grant

• Current Assignee: Movella Incorporated (Movella Holdings, Inc.)
• Original Assignee: mCube, Inc.
• Inventors: Flannery, Anthony F. Jr., KOURY, DANIEL N. Jr.
• Granted Patent: US 9,376,312 B2
• Time in Patent Office: Days
• US Class Current: 438/53
• CPC Class Codes: B81C 1/00142 Bridges deformable micromirrors G02B26/0841
• CPC Class Codes: B81C 1/00261 Processes for packaging MEMS devices MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81C 1/00492 Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

Abstract

An improved MEMS transducer apparatus and method. The method includes providing a movable base structure having a base surface region overlying a substrate and a center cavity with a cavity surface region. At least one center anchor structure and one spring structure can be spatially disposed within a substantially circular portion of the surface region. The spring structure(s) can be coupled the center anchor structure(s) to a portion of the cavity surface region. The substantially circular portion can be configured within a vicinity of the center of the surface region. At least one capacitor element, having a fixed and a movable capacitor element, can be spatially disposed within a vicinity of the cavity surface region. The fixed capacitor element(s) can be coupled to the center anchor structure(s) and the movable capacitor element(s) can be spatially disposed on a portion of the cavity surface region.

Claims

1. A method of fabricating a transducer apparatus, the method comprising:

providing a substrate member having a surface region;

forming a movable base structure having a base surface region;

removing at least one portion of the movable base structure to form a center cavity with a cavity surface region;

forming at least one center anchor structure spatially disposed within a substantially circular portion of the surface region, the center anchor structure(s) being configured within a vicinity of the center of the surface region that is within the center cavity;

forming at least one spring structure coupled to at least one portion of the cavity surface region, the spring structure(s) being coupled to the center anchor structure(s); and

forming at least one capacitor element, the capacitor element(s) being spatially disposed within a vicinity of the cavity surface region.

2. The method of claim 1 wherein the number of the spring structure(s) is proportional to the number of the capacitor element(s).

3. The method of claim 1 wherein the configuration of the spring structure(s) depends on the configuration of the capacitor element(s).

4. The method of claim 1 wherein the movable base structure comprises a silicon material, a polymer, a dielectric, or a metal material.

5. The method of claim 1 wherein the center anchor structure(s) comprise a silicon material, a polymer, a dielectric, or a metal material.

6. The method of claim 1 wherein the spring structure(s) comprise a silicon material, a polymer, a dielectric, or a metal material.

7. The method of claim 1 wherein the movable base structure is a rectangular movable base structure.

8. The method of claim 7 wherein the spring structure(s) are spatially oriented to be 45 degrees or (pi/4) radians to the edges of the rectangular movable base structure.

9. The method of claim 1 wherein the spring structure(s) are spatially oriented to be 45 degrees or (pi/4) radians to the edges of a die.

10. The method of claim 1 wherein the movable base structure comprises a silicon material, a polymer, a dielectric, or a metal material.

11. The method of claim 1 wherein the anchor structure(s) comprises a silicon material, a polymer, a dielectric, or a metal material.

12. The method of claim 1 wherein the spring structure(s) comprises a silicon material, a polymer, a dielectric, or metal material.

13. The method of claim 1 wherein each of the spring structure(s) comprises at least one segment having a segment length.

14. The method of claim 1 wherein the apparatus is operably coupled to a MEMS device or an electronic device.

15. The method of claim 1 configured to fabricate an apparatus tolerant of external deformations.

16. A method of fabricating a transducer apparatus, the method comprising:

providing a substrate member having a surface region;

forming a rectangular movable base structure having a base surface region;

removing at least one portion of the rectangular movable base structure to form a center cavity having a cavity surface region;

forming four anchor structure spatially disposed within a substantially circular portion of the surface region, the center anchor structures being configured within a vicinity of the center of the surface region within the center cavity;

forming four spring structures each of which are coupled to at least one portion of the cavity surface region, the spring structures being coupled to the center anchor structures; and

forming at least one capacitor element coupled to each of the center anchor structures, the capacitor elements being spatially disposed within a vicinity of the cavity surface region.

17. The method of claim 16 wherein the number of the spring structures is proportional to the number of the capacitor elements.

18. The method of claim 16 wherein the configuration of the spring structures depends on the configuration of the capacitor elements.

19. The method of claim 16 wherein the spring structures are spatially oriented to be 45 degrees or (pi/4) radians to the edges of the rectangular movable base structure.

20. The method of claim 16 configured to fabricate an apparatus tolerant of external deformations.