MEMS DEVICE
First Claim
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1. A MEMS gyroscope, comprising:
- a mass-substrate, comprising;
a movable prof-mass; and
a magnetic source attached to the proof-mass such that the magnetic source is capable of moving with the proof-mass; and
a sensor substrate below the mass-substrate, comprising;
a magnetic sensing mechanism for detecting a magnet field from the magnetic sensor, wherein the magnetic sensing mechanism is static relative to the magnetic source, wherein the magnetic sensing mechanism further comprising;
a plurality of magnetic sensors associated with said magnetic source, wherein the plurality of magnetic sensors are deployed in the plane of the sensor substrate at different locations.
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Abstract
A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism comprises multiple magnetic field sensors that are designated for sensing the magnetic field from a magnetic source so as to mitigate the problems caused by fabrication.
14 Citations
20 Claims
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1. A MEMS gyroscope, comprising:
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a mass-substrate, comprising; a movable prof-mass; and a magnetic source attached to the proof-mass such that the magnetic source is capable of moving with the proof-mass; and a sensor substrate below the mass-substrate, comprising; a magnetic sensing mechanism for detecting a magnet field from the magnetic sensor, wherein the magnetic sensing mechanism is static relative to the magnetic source, wherein the magnetic sensing mechanism further comprising; a plurality of magnetic sensors associated with said magnetic source, wherein the plurality of magnetic sensors are deployed in the plane of the sensor substrate at different locations. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A wafer assembly, comprising:
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a mass wafer comprising a plurality of mass dies, each mass die comprising a movable prof-mass; and a magnetic source attached to the proof-mass such that the magnetic source is capable of moving with the proof-mass; and a sensor wafer comprising a plurality of sensor dies, each sensor die comprising; a magnetic sensing mechanism for detecting a magnet field from the magnetic sensor, wherein the magnetic sensing mechanism is static relative to the magnetic source, wherein the magnetic sensing mechanism further comprising; a plurality of magnetic sensors associated with said magnetic source, wherein the plurality of magnetic sensors are deployed in the plane of the sensor substrate at different locations. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification