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HEAT SINK FOR LED LIGHT SOURCE

  • US 20140029259A1
  • Filed: 03/15/2013
  • Published: 01/30/2014
  • Est. Priority Date: 07/30/2012
  • Status: Active Grant
First Claim
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1. A back panel for use in a light emitting diode (LED) lighting assembly comprising:

  • an extruded substrate formed of a thermally conductive material, the substrate having a plurality of fins extending from a first side of the substrate, each of the fins having a substantially rectangular shape oriented so that a longitudinal axis of the fin is substantially parallel to a longitudinal axis of the substrate, wherein at least some of the fins include a hole formed through the fin to enable heated air to rise through the fins, wherein a plurality of LEDs are mounted on a second side of the substrate, and oriented in a longitudinal orientation with the fins oriented parallel to the bottom edge of a surface to be illuminated, such that heat rises perpendicular to the surface of the fin.

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