Microphone Assembly With Barrier To Prevent Contaminant Infiltration

• US 20140044297A1
• Filed: 08/06/2013
• Published: 02/13/2014
• Est. Priority Date: 08/10/2012
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Loeppert, Peter V., Giesecke, Daniel, Vos, Sandra F., Szczech, John B., Lee, Sung Bok, McCall, Ryan M., Van Kessel, Peter
• Granted Patent: US 9,078,063 B2
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/08 Mouthpieces; Microphones; Attachments therefor
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

Claims

1. A microphone assembly comprising:

a cover;

a base coupled to the cover;

a microelectromechanical system (MEMS) device disposed on the base;

an opening in the base and wherein the MEMS device is disposed over the opening;

wherein the base is comprised of a barrier that extends across the opening and is porous to sound, and wherein the remaining portions of the base do not extend across the opening.

2. The microphone assembly of claim 1 wherein the barrier is embedded in the base.

3. The microphone assembly of claim 1 further comprising an integrated circuit coupled to the MEMS device.

4. The microphone assembly of claim 3 wherein the integrated circuit is an application specific integrated circuit (ASIC).

5. The microphone assembly of claim 1 wherein the base comprises a cavity that communicates with the opening and the barrier is disposed within the cavity.

6. The microphone assembly of claim 1 wherein the base comprises multiple layers of materials and the barrier comprises one of the multiple layers.

7. The microphone assembly of claim 1 wherein the barrier comprises a patterned flex printed circuit board (PCB).

8. The microphone assembly of claim 7 wherein the patterned flex PCB comprises a polyimide film.

9. The microphone assembly of claim 1 wherein the barrier is coupled to a bottom surface of the base over the opening.

10. The microphone assembly of claim 9 wherein the base comprises a membrane.

11. A microphone assembly comprising:

a cover;

a base that is attached to the cover;

a microelectromechanical system (MEMS) device disposed on the base;

wherein the base includes a first opening over which the MEMS device is disposed, a channel, and a second opening communicating with the exterior of the assembly, the channel communicating with the first opening and the second opening to provide a path for sound from the exterior of the assembly to the MEMS device.

12. The microphone assembly of claim 11 and wherein the first opening and the second opening are not aligned.

13. The microphone assembly of claim 11 and wherein the first opening and the second opening are aligned.

14. A microphone assembly comprising:

a cover;

a base that is attached to the cover;

a microelectromechanical system (MEMS) device disposed on the base;

wherein the base includes a first opening over which the MEMS device is disposed, and a second opening communicating with the exterior of the assembly, the channel communicating with the first opening and the second opening to provide a path for sound from the exterior of the assembly to the MEMS device, wherein the first opening is aligned with the second opening and the assembly further comprising a barrier disposed within the MEMS device and on the base, wherein the barrier is porous to sound.

15. The microphone assembly of claim 14 wherein the barrier includes a hollow path allowing sound to traverse from the exterior of the assembly to the MEMS device.

16. The assembly of claim 14 wherein the barrier is formed with a first trench communicating with the MEMS device and a second trench communicating with the exterior of the assembly and a channel communicating with the first trench and the second trench.

17. The assembly of claim 14 wherein the barrier is formed with a first trench communicating with the MEMS device and a second trench communicating with the exterior of the assembly, and wherein the first trench and the second trench communicate with each other.

18. The assembly of claim 14 wherein the barrier is a solid piece.

19. A microphone assembly comprising:

a cover;

a base that is attached to the cover;

a microelectromechanical system (MEMS) device disposed on the base;

wherein the cover includes a porous portion and a non-porous portion, the porous portion allowing sound to pass there through but not allowing particulates to pass there through.

20. The microphone assembly of claim 19 further comprising an integrated circuit coupled to the MEMS device.

21. The microphone assembly of claim 19 wherein the integrated circuit is an application specific integrated circuit (ASIC).

22. The microphone assembly of claim 19 wherein the cover comprises a metal.

23. The microphone assembly of claim 19 wherein the porous portion comprises a metal mesh.

24. The microphone assembly of claim 19 wherein the porous portion comprise a partially fused or sintered metal.