METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

• US 20140057131A1
• Filed: 03/29/2011
• Published: 02/27/2014
• Est. Priority Date: 03/23/2011
• Status: Active Grant

• Current Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Original Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Inventors: Osanai, Hideyo, Takahashi, Takayuki, Ideguchi, Satoru, Kotani, Hirotaka
• Granted Patent: US 9,713,253 B2
• Time in Patent Office: Days
• US Class Current: 428/633
• CPC Class Codes: B22D 19/0081 pretreatment of the insert, e.g. for enhancing the bonding between insert and surrounding cast metal
• CPC Class Codes: B22D 19/04 for joining parts
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/09136 Means for correcting warpage
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/128 Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder spraying droplets of molten metal H05K2203/1344
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: Y10T 428/12618 Plural oxides
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/2462 with partial filling of valleys on outer surface
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree

Abstract

A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

Claims

1. A metal/ceramic bonding substrate comprising:

a ceramic substrate;

a metal plate bonded directly to one side of the ceramic substrate;

a metal base plate bonded directly to the other side of the ceramic substrate; and

a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

2. A metal/ceramic bonding substrate as set forth in claim 1, wherein said both end faces of said metal base plate are both end faces in longitudinal directions or lateral directions of said metal base plate.

3. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal base plate has a portion extending in directions substantially perpendicular to said bonded surface.

4. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing member is surrounded by said metal base plate.

5. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing member extends through the interior of said metal base plate.

6. A metal/ceramic bonding substrate as set forth in claim 5, wherein said reinforcing member is a plate member extending in substantially parallel to said bonded surface.

7. A metal/ceramic boding substrate as set forth in claim 6, wherein said reinforcing member has a surface which extends in substantially parallel to said bonded surface and which has a portion facing said ceramic substrate, the portion of the surface of said reinforcing member having a smaller area than that of said bonded surface.

8. A metal/ceramic bonding substrate as set forth in claim 5, wherein said reinforcing member comprises a plurality of plate or rod members which are arranged on a plane extending in substantially parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in substantially parallel to each other.

9. A metal/ceramic bonding substrate as set forth in claim 5, wherein said reinforcing member is a lattice-shaped plate member comprising a plurality of longitudinal plate portions, which are arranged on a plane extending in substantially parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in longitudinal directions of said metal base plate, and a plurality of lateral plate portions which are spaced from each other at predetermined intervals to extend in lateral directions of said metal base plate to connect the longitudinal plate portions to each other.

10. A metal/ceramic bonding substrate as set forth in claim 5, wherein the whole surface of a portion of said reinforcing member extending through the interior of said metal base plate is bonded directly to said metal base plate.

11. A metal/ceramic bonding substrate as set forth in claim 5, wherein an end face of said reinforcing member is exposed to the outside, and the whole surface of said reinforcing member expect for the end face thereof is bonded directly to said metal base plate.

12. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing member is made of a steel or a metal which contains iron and at least one selected from the group consisting of nickel, cobalt, copper and manganese.

13. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing member is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

14. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal base plate is made of aluminum or an aluminum alloy.

15. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal plate is made of aluminum or an aluminum alloy.

16. A metal/ceramic bonding substrate as set forth in claim 1, wherein said ceramic substrate is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

17. A method for producing a metal/ceramic bonding substrate wherein a metal plate is bonded to one side of a ceramic substrate and wherein a metal base plate is bonded directly to the other side thereof, said method comprising the steps of:

preparing a reinforcing member which has a higher melting point and a higher strength than those of the metal base plate;

supporting end portions of the ceramic substrate and end portions of the reinforcing member on a mold so that the ceramic substrate and the reinforcing member are arranged in the mold at a predetermined interval;

injecting a molten metal into the mold so that the molten metal contacts the reinforcing member and both faces of the ceramic substrate in the mold; and

cooling the mold to solidify the molten metal to form the metal plate, which is bonded directly to one side of said ceramic substrate, and to form the metal base plate, which is bonded directly to the other side of said ceramic substrate, while protruding an end portion of the reinforcing member from the metal base plate.

18. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein the whole surface of said reinforcing member except for the end portion of the reinforcing member protruding from the metal base plate is bonded directly to the metal base member by injecting said molten metal so that the molten metal contacts the whole surface of the reinforcing member except for the end portion when said molten metal is injected into the mold.

19. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein said end portion of said reinforcing member protruding from the metal base plate is removed.

20. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein said mold comprises an upper mold member and a lower mold member, and said end portion of said reinforcing member is clamped by the upper mold member and the lower mold member to be supported on said mold.

21. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein said reinforcing member is made of a steel or a metal which contains iron and at least one selected from the group consisting of nickel, cobalt, copper and manganese.

22. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein said reinforcing member is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

23. A method for producing a metal/ceramic bonding substrate as set forth in claim 17, wherein said metal plate and said metal base plate are made of aluminum or an aluminum alloy.

24. A metal/ceramic bonding substrate comprising:

a ceramic substrate;

an aluminum member of aluminum or an aluminum alloy, the aluminum member being bonded directly to one side of the ceramic substrate; and

a spray-coated member having a metal member, the surface of which is coated with a sprayed coating, the spray-coated member being arranged in the aluminum member.

25. A metal/ceramic bonding substrate as set forth in claim 24, wherein said sprayed coating is a coating of at least one ceramic selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide and silicon nitride.

26. A metal/ceramic bonding substrate as set forth in claim 25, wherein said metal member is made of copper or a copper alloy.

27. A metal/ceramic bonding substrate as set forth in claim 24, wherein an aluminum plate of aluminum or an aluminum alloy is bonded directly to the other side of said ceramic substrate.

28. A metal/ceramic bonding substrate as set forth in claim 24, wherein said aluminum member has a plate shape, or a shape of a plate integrated with a plurality of fins.

29. A method for producing a metal/ceramic bonding substrate comprising the steps of:

spray-coating a surface of a metal member with a ceramic to obtain a spray-coated member wherein the surface of the metal member is coated with a sprayed coating;

arranging the spray-coated member and a ceramic substrate in a mold at a predetermined interval;

injecting a molten metal of aluminum or an aluminum alloy into the mold so that the molten metal contacts the whole surface of the spray-coated member and one side of the ceramic substrate in the mold; and

cooling the mold to solidify the molten metal to form an aluminum member of aluminum or the aluminum alloy, which surrounds the spray-coated member and which is bonded directly to the one side of the ceramic substrate.

30. A method for producing a metal/ceramic bonding substrate as set forth in claim 29, wherein said spray coating is the plasma spray coating.

31. A method for producing a metal/ceramic bonding substrate as set forth in claim 29, wherein said ceramic used in said spray coating is at least one selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide and silicon nitride.

32. A method for producing a metal/ceramic bonding substrate as set forth in claim 31, wherein said metal member is made of copper or a copper alloy.

33. A method for producing a metal/ceramic bonding substrate as set forth in claim 29, wherein an aluminum plate of aluminum or an aluminum alloy, which is bonded directly to the other side of said ceramic substrate, is formed by injecting said molten metal of aluminum or the aluminum alloy into the mold so that the molten metal contacts the other side of said ceramic substrate.