COMPOSITIONS, GELS AND FOAMS WITH RHEOLOGY MODULATORS AND USES THEREOF
First Claim
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1. A surfactant free composition for cosmetic or pharmaceutical application comprising:
- a) a first rheology modulator comprising a suspended pharmaceutical active agent or a suspended cosmetic active agent;
b) a second rheology modulator comprising at least one fatty alcohol, at least one fatty acid, at least one wax and mixtures thereof; and
c) a hydrophobic carrier comprising at least one hydrophobic solvent;
wherein the viscosity of the composition is at least about 30% higher than the viscosity of a first partial composition comprising the second rheology modulator agent and the hydrophobic carrier without the first rheology modulator; and
is higher than the viscosity of a second partial composition comprising the first rheology modulator and the hydrophobic carrier without the second rheology modulator; and
wherein the viscosity of the first partial composition is less than about 25,000 cPs at room temperature.
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Abstract
The present disclosure relates generally to compositions for cosmetic or pharmaceutical application. The compositions include a carrier and rheology modulators.
43 Citations
1 Claim
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1. A surfactant free composition for cosmetic or pharmaceutical application comprising:
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a) a first rheology modulator comprising a suspended pharmaceutical active agent or a suspended cosmetic active agent; b) a second rheology modulator comprising at least one fatty alcohol, at least one fatty acid, at least one wax and mixtures thereof; and c) a hydrophobic carrier comprising at least one hydrophobic solvent; wherein the viscosity of the composition is at least about 30% higher than the viscosity of a first partial composition comprising the second rheology modulator agent and the hydrophobic carrier without the first rheology modulator; and
is higher than the viscosity of a second partial composition comprising the first rheology modulator and the hydrophobic carrier without the second rheology modulator; andwherein the viscosity of the first partial composition is less than about 25,000 cPs at room temperature.
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Specification