HETEROGENEOUS ENCAPSULATION

• US 20140098505A1
• Filed: 10/05/2012
• Published: 04/10/2014
• Est. Priority Date: 10/05/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Baker, John J.
• Granted Patent: US 8,946,566 B2
• Time in Patent Office: Days
• US Class Current: 361/764
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according to the particular requirements of the electronic devices in that region.

Claims

1. An electronic device comprising:

a substrate having first and second non-overlapping regions;

at least first electronic component attached to the first region of the substrate, wherein the first electronic component is sealed with a first encapsulant; and

a second encapsulant formed over the second region of the substrate, the second encapsulant having mechanical, electrical and/or chemical properties different from mechanical, electrical and/or chemical properties of the first encapsulant.

2. The electronic device set forth in claim 1 further comprising at least a second electronic component attached to the second region and sealed with the second encapsulant.

3. The electronic device set forth in claim 2 wherein the first encapsulant is an epoxy material.

4. The electronic device set forth in claim 3 wherein the second encapsulant is a silicone material.

5. The electronic device set forth in claim 4 wherein the epoxy material is curable with ultra-violet light and the silicone material is curable using both heat and moisture.

6. The electronic device set forth in claim 2 wherein the first electronic component is an integrated circuit and the second electronic component is an electrical connector.

7. The electronic device set forth in claim 6 wherein the electrical connector is bonded to a plurality of bonding pads formed on the substrate and the second encapsulant seals an edge of a body of the connector to the substrate and covers the bonding pads.

8. The electronic device set forth in claim 7 wherein the first encapsulant is an epoxy material and the second encapsulant is a silicone material that is more compliant than the epoxy material.

9. The electronic device set forth in claim 8 wherein the second encapsulant is applied on first and second opposing sides of the substrate and extends between the body of the connector an edge of the substrate.

10. An electronic device comprising:

a printed circuit board;

a first plurality of bonding pads formed on the printed circuit board;

a first plurality of electronic components attached to a first region of the printed circuit;

a first encapsulant covering the first region of the printed circuit board including the first plurality of electronic components;

an electronic connector having a housing and a plurality of leads the extend from the housing attached to the first plurality of bonding pads, wherein an exterior surface of the housing of the electronic connector is spaced apart from a second region of the printed circuit board different than the first region;

a second encapsulant extending between the exterior surface of the housing to the second region of the printed circuit board and covering the plurality of leads attached to the first plurality of bonding pads, wherein the second encapsulant is more compliant than the first encapsulant.

11. The electronic device set forth in claim 10 wherein the first encapsulant is a silicone material.

12. The electronic device set forth in claim 11 wherein the silicone material is curable using both heat and moisture.

13. The electronic device set forth in claim 11 wherein the second encapsulant is an epoxy material that is less compliant than the silicone material.

14. The electronic device set forth in claim 13 wherein the epoxy material is curable with ultra-violet light.

15. The electronic device set forth in claim 10 further comprising a second plurality of bonding pads formed on the printed circuit board and a second connector coupled to the second plurality of bonding pads by a flex cable.

16. The electronic device set forth in claim 10 wherein the second plurality of bonding pads and an end portion of the flex cable are covered by the second encapsulant.

17. The electronic device set forth in claim 10 further comprising a conductive dam bar attached to the flex cable.

18. The electronic device set forth in claim 10 further comprising a metal shield the surrounds the printed circuit board.

19. The electronic device set forth in claim 10 further comprising a second connector that is incompatible with the first connector.

20. An adapter for providing a communication path between first and second electronic devices, the adapter comprising:

a printed circuit board having non-overlapping first, second and third regions;

a first plurality bonding pads formed in the second region of the printed circuit board;

a second plurality of bonding pads formed in the third region of the printed circuit board;

a plurality of electronic components attached to the printed circuit in the first region;

a first electrical connector having a housing and a plurality of leads that extend from the housing attached to the first plurality of bonding pads, wherein an exterior surface of the housing of the electronic connector is spaced apart from the second region of the printed circuit board;

a second electrical connector attached to printed circuit board;

a flex cable coupled between the second electrical connector and the second plurality of bonding pads;

an epoxy encapsulant covering the first region of the printed circuit board including the first plurality of electronic components; and

a silicone encapsulant covering the second and third regions of the printed circuit board including the first and second pluralities of bonding pads.

21. The electronic device set forth in claim 20 wherein:

the first connector is a receptacle connector has a body that is spaced apart from the printed circuit board;

the plurality of leads extend from the body over an edge of the printed circuit board to the first plurality of bonding pads; and

the silicone encapsulant extends from the second region of the printed circuit board to the body covering the edge of the printed circuit board.

22. A method of forming a substrate assembly comprising:

attaching a plurality of electronic components to a substrate;

sealing a first region of the substrate with a first encapsulant; and

sealing a second region of the substrate with a second encapsulant that has mechanical and chemical properties different from mechanical and chemical properties of the first encapsulant.

23. The method of claim 22 wherein the substrate is a printed circuit board.

24. The method of claim 23 wherein the first encapsulant is a relatively hard and rigid epoxy encapsulant that is applied over one or more of the electronic components attached to the printed circuit board and the second encapsulant is a relatively compliant silicone encapsulant that is applied between an electrical connector and the printed circuit board and covers a plurality of leads that extend out of the connector and are electrically attached to bonding pads on the printed circuit board.

25. The method of claim 23 further comprising attaching a metallic shield around at least a portion of the printed circuit board and filling space between the shield and the printed circuit board with an injection molded plastic.