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METHOD FOR IMPLEMENTING A MULTI-CHIP MODULE WITH A HIGH-RATE INTERFACE

  • US 20140098825A1
  • Filed: 10/09/2012
  • Published: 04/10/2014
  • Est. Priority Date: 10/09/2012
  • Status: Active Grant
First Claim
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1. A multi-chip module, comprising:

  • a substrate;

    a first physical-layer (PHY) chip mounted on the substrate, the first PHY chip comprising a multiplexer and a physical-layer (PHY) circuit;

    a second PHY chip mounted on the substrate; and

    an interface coupling the first PHY chip to the second PHY chip;

    wherein the multiplexer of the first PHY chip is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into a first data stream and a second data stream, to output the first data stream to the PHY circuit of the first PHY chip, and to output the second data stream to the second PHY chip via the interface.

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