LIGHT-EMITTING DEVICE

• US 20140103798A1
• Filed: 12/26/2013
• Published: 04/17/2014
• Est. Priority Date: 06/30/2011
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: YAMANAKA, Kazuhiko, YOSHIDA, Shinji, TAKIGAWA, Shinichi, KATAYAMA, Takuma, NAKANISHI, Hideyuki, TANAKA, Tsuyoshi
• Granted Patent: US 8,922,118 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H05B 33/04 : Sealing arrangements , e.g. against humidity

Abstract

A light-emitting device includes: a package; a semiconductor light-emitting element mounted above the package; a cap component provided above the package; a sealing component which seals a space between the package and the cap component; and a phosphor containing resin including phosphor disposed in the sealed space.

Claims

1. A light-emitting device comprising:

a package;

a semiconductor light-emitting element mounted above the package;

a cap component provided above the package;

a sealing component which seals a space between the package and the cap component; and

phosphor disposed in the sealed space.

2. The light-emitting device according to claim 1,

wherein a cavity including gas is formed in the sealed space.

3. The light-emitting device according to claim 2,

wherein the cavity includes gas other than oxygen or is a vacuum.

4. The light-emitting device according to claim 1,

wherein the package has a structure in which a metal line is embedded in a ceramic material.

5. The light-emitting device according to claim 1,

wherein the cap component comprises a translucent acrylic resin or a translucent epoxy resin.

6. The light-emitting device according to claim 1,

wherein the cap component comprises translucent glass.

7. The light-emitting device according to claim 1,

wherein a surface of at least one of the cap component and the package is treated to be water repellent, the surface being a surface facing the semiconductor light-emitting element.

8. The light-emitting device according to claim 1,

wherein the phosphor includes a plurality of types of phosphor particles.

9. The light-emitting device according to claim 1,

wherein the phosphor is quantum dot phosphor.

10. The light-emitting device according to claim 8,

wherein the phosphor particles of the types are enclosed in the sealed space.

11. The light-emitting device according to claim 1,

wherein at least one of types of the phosphor includes a rare-earth activated phosphor material.

12. The light-emitting device according to claim 1,

wherein the phosphor is mixed into different resin materials.

13. The light-emitting device according to claim 1,

wherein the cap component includes phosphor.