WIRELESS IC DEVICE COMPONENT AND WIRELESS IC DEVICE

• US 20140117099A1
• Filed: 01/10/2014
• Published: 05/01/2014
• Est. Priority Date: 04/14/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATO, Noboru, DOKAI, Yuya
• Granted Patent: US 8,876,010 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/26 with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.

Claims

1. (canceled)

2. A wireless IC device comprising:

a wireless IC chip;

an annular coupling electrode including connecting portions arranged to be connected to the wireless IC chip, a pair of end portions arranged opposite to each other, and an opening portion defined by an inner edge of the annular coupling electrode;

a dielectric substrate disposed in the opening portion of the annular coupling electrode; and

a radiation plate coupled to the annular coupling electrode;

wherein

a main surface of the annular coupling electrode is perpendicular or substantially perpendicular to a main surface of the radiation plate; and

the dielectric substrate is mounted on the main surface of the radiation electrode.

3. The wireless IC device according to claim 2, wherein the dielectric substrate includes a first main surface and a second main surface opposite to the first main surface, the wireless IC chip is provided on the first main surface of the dielectric substrate, and each of the pair of end portions of the annular coupling electrode is provided on the second main surface of the dielectric substrate.

4. The wireless IC device according to claim 3, wherein the dielectric substrate includes a hole, and the wireless IC chip is disposed in the hole.

5. The wireless IC device according to claim 3, wherein each of the pair of end portions of the annular coupling electrode is arranged at a location different from the connecting portions of the annular coupling electrode in plan view.

6. The wireless IC device according to claim 2, wherein the dielectric substrate is a flexible dielectric substrate.

7. The wireless IC device according to claim 2, wherein the dielectric substrate has a rectangular or substantially rectangular shape having a longitudinal direction and a latitudinal direction in plan view, and the connecting portions of the annular coupling electrode are arranged along the longitudinal direction of the dielectric substrate.