Semiconductor Device and Method of Manufacture Thereof
First Claim
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1. A semiconductor package comprising:
- a first semiconductor chip comprising a first coil disposed over a first substrate;
an isolating film disposed on the first semiconductor; and
a second semiconductor chip comprising a second coil disposed over a second substrate, wherein the second semiconductor chip is attached to the first semiconductor chip with the isolating film, wherein the first coil of the first semiconductor chip is inductively coupled through the isolating film with the second coil of the second semiconductor chip to form a coreless transformer.
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Abstract
A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.
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Citations
24 Claims
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1. A semiconductor package comprising:
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a first semiconductor chip comprising a first coil disposed over a first substrate; an isolating film disposed on the first semiconductor; and a second semiconductor chip comprising a second coil disposed over a second substrate, wherein the second semiconductor chip is attached to the first semiconductor chip with the isolating film, wherein the first coil of the first semiconductor chip is inductively coupled through the isolating film with the second coil of the second semiconductor chip to form a coreless transformer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package comprising:
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a lead frame; a first semiconductor chip comprising a first coil disposed over a first substrate, the first semiconductor chip disposed on the lead frame; a second semiconductor chip comprising a second coil disposed over a second substrate, the second coil aligned with the first coil, the second semiconductor chip disposed on the first semiconductor chip; an isolating film disposed between the first semiconductor chip and the second semiconductor chip, wherein the second semiconductor chip is attached to the first semiconductor chip with the isolating film, wherein the first coil of the first semiconductor chip is inductively coupled through the isolating film with the second coil of the second semiconductor chip to form a coreless transformer; and an encapsulation material encapsulating the first semiconductor chip, the second semiconductor chip and the lead frame. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A semiconductor package comprising:
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a first semiconductor chip with a first coil disposed over a first substrate; a second semiconductor chip with a second coil and a contact pad disposed over a second substrate; and an isolating film disposed between the first semiconductor chip and the second semiconductor chip, wherein the second semiconductor chip is attached to the first semiconductor chip with the isolating film, wherein the first coil of the first semiconductor chip is inductively coupled through the isolating film with the second coil of the second semiconductor chip; a through hole disposed in the second substrate and exposing the contact pad; a wire disposed within the through hole; and a wire bond disposed in the through hole coupling the wire to the contact pad of the second semiconductor chip. - View Dependent Claims (23, 24)
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Specification