LIQUID COOLING SYSTEM FOR A SERVER

• US 20140168889A1
• Filed: 02/21/2014
• Published: 06/19/2014
• Est. Priority Date: 08/26/2010
• Status: Active Grant

• Current Assignee: Asetek Incorporated (Asetek Holdings Incorporated)
• Original Assignee: Asetek Incorporated (Asetek Holdings Incorporated)
• Inventors: Branton, Steven B.
• Granted Patent: US 8,749,968 B1
• Time in Patent Office: Days
• US Class Current: 361/679.53
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20263 Heat dissipaters releasing heat from coolant
• CPC Class Codes: H05K 7/20754 Air circulating in closed loop within cabinets
• CPC Class Codes: H05K 7/20763 Liquid cooling without phase change
• CPC Class Codes: H05K 7/20781 within cabinets for removing heat from server blades

Abstract

A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Claims

1. A cooling system for a computer server rack comprising at least one server module, the cooling system comprising:

a first liquid cooling loop comprising at least one first cold plate placed in thermal contact with a heat generating component of the server module, and a first plurality of conduits configured to circulate a first liquid cooling medium through the at least one first cold plate;

a second liquid cooling loop comprising a second plurality of conduits configured to circulate a second liquid cooling medium therethrough; and

a first liquid-to-liquid heat exchanger fluidly coupled to the first cooling loop and the second cooling loop and configured to transfer heat from the first liquid cooling medium to the second liquid cooling medium.

2. The cooling system of claim 1, wherein the liquid-to-liquid heat exchanger is positioned proximate to the server module.

3. The cooling system of claim 1, wherein the liquid-to-liquid heat exchanger is mounted on the server module.

4. The cooling system of claim 1, wherein the second liquid cooling loop comprises a cooling device configured to draw heat from the second liquid cooling medium.

5. The cooling system of claim 4, wherein the cooling device is positioned remote from the server rack.

6. The cooling system of claim 4, wherein the cooling device comprises a heat exchanger.

7. The cooling system of claim 6, wherein the heat exchanger is a second liquid-to-liquid heat exchanger.

8. The cooling system of claim 4, wherein the cooling device comprises a chiller.

9. The cooling system of claim 1, wherein the second liquid cooling loop comprises at least one pump to drive the second liquid cooling medium through the second liquid cooling loop.

10. The cooling system of claim 1, wherein the at least one first cold plate comprises fins, pins, or other features configured to assist in the transfer of heat from the cold plate to the first liquid cooling medium.

11. The cooling system of claim 1, wherein the first liquid cooling loop comprises at least one pump to drive the first liquid cooling medium through the first liquid cooling loop.

12. The cooling system of claim 1, wherein the first liquid-to-liquid heat exchanger comprises a heat sink and a second cold plate in thermal contact with each other.

13. The cooling system of claim 12, wherein the heat sink is fluidly coupled to the first plurality of conduits, and the second cold plate is fluidly coupled to the second plurality of conduits

14. The cooling system of claim 12, wherein the heat sink comprises a conductive plate having a first surface exposed to the first liquid cooling medium and a second surface in thermal contact with the second cold plate.

15. The cooling system of claim 14, wherein the first surface of the conductive plate comprises fins adapted to facilitate transfer of heat from the first liquid cooling medium to the second cold plate.