Test Equipment for Testing Semiconductor Device and Methods of Testing Semiconductor Device Using the Same
First Claim
1. A method of testing a semiconductor device, the method comprising:
- loading in a test equipment at a loading part thereof an undivided printed circuit board (PCB) including a plurality of unit PCBs with a semiconductor device being mounted in each of the unit PCBs;
confirming product information of the undivided PCB at the loading part of the test equipment;
electrically connecting the undivided PCB whose product information has been confirmed to one of a plurality of main testers at a testing part of the test equipment, wherein each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored;
transmitting the product information of the undivided PCB to the main tester electrically connected to the undivided PCB;
using the main tester, performing a main test of the undivided PCB using the transmitted product information; and
unloading the undivided PCB on which the main test has been performed by the main tester from the test equipment.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.
9 Citations
20 Claims
-
1. A method of testing a semiconductor device, the method comprising:
-
loading in a test equipment at a loading part thereof an undivided printed circuit board (PCB) including a plurality of unit PCBs with a semiconductor device being mounted in each of the unit PCBs; confirming product information of the undivided PCB at the loading part of the test equipment; electrically connecting the undivided PCB whose product information has been confirmed to one of a plurality of main testers at a testing part of the test equipment, wherein each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored; transmitting the product information of the undivided PCB to the main tester electrically connected to the undivided PCB; using the main tester, performing a main test of the undivided PCB using the transmitted product information; and unloading the undivided PCB on which the main test has been performed by the main tester from the test equipment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of testing a semiconductor device, the method comprising:
-
loading an undivided printed circuit board (PCB) in a test equipment, wherein the undivided PCB includes a plurality of unit PCBs, each unit PCB including a semiconductor device; moving the undivided PCB to an electrical connection test chamber of the test equipment; confirming product information of the undivided PCB disposed in the electrical connection test chamber using a code recognition unit of the electrical connection test chamber; transmitting the product information of the undivided PCB to an electrical connection test unit of the electrical connection test chamber, the electrical connection test unit being directly connected to a cloud server; performing an electrical connection test of the undivided PCB using the product information using the electrical connection test unit; electrically connecting the undivided PCB, which has passed the electrical connection test, to one of a plurality of main testers of the test equipment, the main testers being discretely connected to the cloud server; transmitting the product information of the undivided PCB to the main tester electrically connected to the undivided PCB; using the main tester, performing a main test of the undivided PCB using the transmitted product information; recording results of the main test on the undivided PCB on which the main test has been performed by the main tester; and classifying the undivided PCB on which the results of the main test are recorded based on the results of the main test. - View Dependent Claims (14, 15)
-
-
16. A method of testing a semiconductor device, the method comprising:
-
loading an undivided printed circuit board (PCB) in a loading area of a test equipment, wherein the undivided PCB includes a plurality of unit PCBs, each unit PCB including a semiconductor device; confirming product information of the undivided PCB using a code recognition unit disposed at the loading area; conveying the undivided PCB to a testing area of the test equipment; electrically connecting the undivided PCB to a main tester at the testing area; receiving firmware corresponding to the product information from a cloud server at the main tester; and performing a main test of the undivided PCB at the main tester using the received firmware. - View Dependent Claims (17, 18, 19, 20)
-
Specification