DEFECT PATTERN EVALUATION METHOD, DEFECT PATTERN EVALUATION APPARATUS, AND RECORDING MEDIA
First Claim
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1. A defect pattern evaluation method, comprising:
- performing optical defect inspection on a pattern on a substrate after a predetermined process for manufacturing a semiconductor device;
detecting defects by the optical defect inspection;
classifying the defects according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects;
calculating using a computer a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region through a computer; and
outputting the defect occurrence rate of each pattern layout as an evaluation result.
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Abstract
According to a defect pattern evaluation method of an embodiment, defects are detected by performing optical defect inspection on a pattern on a substrate. Then, the defects are classified according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects. Further, a computer calculates a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region. Then, the defect occurrence rate of each pattern layout is output as an evaluation result.
6 Citations
20 Claims
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1. A defect pattern evaluation method, comprising:
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performing optical defect inspection on a pattern on a substrate after a predetermined process for manufacturing a semiconductor device; detecting defects by the optical defect inspection; classifying the defects according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects; calculating using a computer a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region through a computer; and outputting the defect occurrence rate of each pattern layout as an evaluation result. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A defect pattern evaluation apparatus, comprising:
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a classifying unit that classifies defects detected by performing optical defect inspection on a pattern on a substrate after a predetermined process for manufacturing a semiconductor device according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects; a defect occurrence rate calculating unit that calculates a defect occurrence rate which is a rate between the number of defects of each pattern layout and an arrangement number of the pattern layouts in an inspection region; and an output unit that outputs the defect occurrence rate of each pattern layout as an evaluation result. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A non-transitory computer-readable recording medium recording a defect evaluation program causing a computer to evaluate a pattern on a substrate which has been subjected to optical defect inspection after a predetermined process for manufacturing a semiconductor device, the defect evaluation program causing the computer to execute:
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classifying defects detected by the optical defect inspection according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects; calculating a defect occurrence rate which is a rate between the number of defects of each pattern layout and an arrangement number of the pattern layouts in an inspection region; and outputting the defect occurrence rate of each pattern layout as an evaluation result. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification