Micro Pick Up Array Mount With Integrated Displacement Sensor

• US 20140241844A1
• Filed: 02/25/2013
• Published: 08/28/2014
• Est. Priority Date: 02/25/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: LuxVue Techonology Corporation (Apple Inc.)
• Inventors: Golda, Dariusz, Higginson, John A., Bibl, Andreas, Parks, Paul Argus, Bathurst, Stephen Paul
• Granted Patent: US 9,095,980 B2
• Time in Patent Office: Days
• US Class Current: 414/751.1
• CPC Class Codes: B25J 11/00 Manipulators not otherwise provided for
• CPC Class Codes: B25J 15/0052 multiple gripper units or multiple end effectors
• CPC Class Codes: B25J 15/0085 with means for applying an electrostatic force on the object to be gripped
• CPC Class Codes: B25J 7/00 Micromanipulators specimen supports for investigating or analysing materials G01N23/2204; associated with microscopes G02B21/32; means for supporting or positioning the objects or the material in discharge tubes H01J37/20
• CPC Class Codes: B25J 9/0015 Flexure members, i.e. parts of manipulators having a narrowed section allowing articulation by flexion
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Claims

1. A micro pick up array mount comprising:

a pivot platform;

a base laterally around the pivot platform;

a compliant element between the pivot platform and the base, wherein the compliant element is coupled with the pivot platform at an inner pivot and coupled with the base at an outer pivot; and

a displacement sensor integrated with the compliant element.

2. The micro pick up array mount of claim 1, wherein the outer pivot is on a base edge and the inner pivot is on a pivot platform edge, and wherein the base edge is orthogonal to the pivot platform edge.

3. The micro pick up array mount of claim 2, further comprising:

a second compliant element coupled with the base by a second outer pivot on a second base edge and coupled with the pivot platform by a second inner pivot on a second pivot platform edge; and

a second displacement sensor integrated with the second compliant element.

4. The micro pick up array mount of claim 2, wherein the compliant element is coupled with the pivot platform at a second inner pivot and coupled with the base at a second outer pivot.

5. The micro pick up array mount of claim 4, wherein the inner pivot is across the pivot platform from the second inner pivot, and wherein the outer pivot is across the pivot platform from the second outer pivot.

6. The micro pick up array mount of claim 1, wherein the compliant element comprises a beam, wherein the displacement sensor comprises a strain gauge, and wherein the strain gauge is integrated with the beam in a high strain region near the inner pivot or the outer pivot.

7. The micro pick up array mount of claim 6, wherein the strain gauge is bonded to the high strain region.

8. The micro pick up array mount of claim 6, wherein the strain gauge is deposited on the high strain region.

9. The micro pick up array mount of claim 6, wherein the high strain region is doped to form the strain gauge.

10. The micro pick up array mount of claim 6, further comprising a reference strain gauge adjacent to the strain gauge on the beam, wherein the strain gauge and the reference strain gauge provide adjacent legs in a half Wheatstone bridge.

11. The micro pick up array mount of claim 1, further comprising a temperature sensor on the pivot platform.

12. The micro pick up array mount of claim 1, further comprising a heating contact on the base in electrical connection with a heating element over the pivot platform.

13. The micro pick up array mount of claim 12, wherein the heating element comprises a resistance alloy.

14. The micro pick up array mount of claim 12, wherein the heating element comprises a surface-mount technology resistor.

15. The micro pick up array mount of claim 1, further comprising a displacement sensor contact on the base in electrical connection with the displacement sensor.

16. The micro pick up array mount of claim 1, further comprising a base operating voltage contact on the base in electrical connection with a pivot platform operating voltage contact on the pivot platform.

17. The micro pick up array mount of claim 1, further comprising a base clamp contact on the base in electrical connection with a clamp electrode at a bonding site on the pivot platform.

18. The micro pick up array mount of claim 1, further comprising a bonding site on the pivot platform, wherein the bonding site comprises a metal selected from the group consisting of:

gold, copper, and aluminum.