CHIP PACKAGE AND METHOD FOR FORMING THE SAME

• US 20140252642A1
• Filed: 03/05/2014
• Published: 09/11/2014
• Est. Priority Date: 03/07/2013
• Status: Active Grant

• Current Assignee: Xintec Incorporated
• Original Assignee: Xintec Incorporated
• Inventors: LOU, Bai-Yao, CHEN, Shih-Kuang, LEE, Sheng-Yuan
• Granted Patent: US 9,449,897 B2
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An embodiment of the invention provides a chip package which includes: a semiconductor substrate; a device region formed in the semiconductor substrate; at least a conducting pad disposed over a surface of the semiconductor substrate; a protection plate disposed over the surface of the semiconductor substrate; and a spacer layer disposed between the surface of the semiconductor substrate and the protection plate, wherein the protection plate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface.

Claims

1. A chip package, comprising:

a semiconductor substrate;

a device region formed in the semiconductor substrate;

at least one conducting pad disposed over a surface of the semiconductor substrate;

a protection substrate disposed over the surface of the semiconductor substrate; and

a spacer layer disposed between the surface of the semiconductor substrate and the protection substrate, wherein the protection substrate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface.

2. The chip package as claimed in claim 1, wherein the spacer layer has an inner side surface near the cavity, wherein the surface roughness of the inner side surface of the spacer layer is substantially the same as the surface roughness of the outer side surface of the spacer layer.

3. The chip package as claimed in claim 2, wherein the inner side surface and the outer side surface of the spacer layer are parallel to each other.

4. The chip package as claimed in claim 1, wherein a side surface of the protection substrate protrudes from the outer side surface of the spacer layer.

5. The chip package as claimed in claim 1, wherein the spacer layer is closer to the device region than the at least one conducting pad.

6. The chip package as claimed in claim 1, wherein a projection of the spacer layer on the surface of the semiconductor substrate does not overlap with a protection of the at least one conducting pad on the surface of the semiconductor substrate.

7. The chip package as claimed in claim 1, wherein the spacer layer is in direct contact with the protection substrate.

8. The chip package as claimed in claim 1, wherein the protection substrate is a transparent substrate.

9. The chip package as claimed in claim 1, wherein the cavity is a substantially closed cavity.

10. The chip package as claimed in claim 1, further comprising an adhesion layer disposed between the spacer layer and the semiconductor substrate.

11. A method for forming a chip package, comprising:

providing a semiconductor substrate, wherein at least one device region is formed in the semiconductor substrate, and at least one conducting pad is disposed over a surface of the semiconductor substrate;

providing a protection substrate;

disposing a spacer layer over the surface of the semiconductor substrate or over the protection substrate;

disposing a sacrificial support layer over the surface of the semiconductor substrate or over the protection substrate;

disposing the protection substrate over the surface of the semiconductor substrate such that the protection substrate and the spacer layer surround a cavity over the at least one device region; and

dicing and removing a portion of the protection substrate and a portion of the sacrificial support layer to expose the at least one conducting pad.

12. The method for forming a chip package as claimed in claim 11, further comprising performing a dicing process along at least one predetermined scribe line of the semiconductor substrate to form a plurality of chip packages separated from each other.

13. The method for forming a chip package as claimed in claim 12, wherein the dicing process is performed after the step of dicing and removing the portion of the protection substrate and the portion of the sacrificial support layer to expose the at least one conducting pad.

14. The method for forming a chip package as claimed in claim 12, wherein the sacrificial support layer surrounds the spacer layer and the at least one device region.

15. The method for forming a chip package as claimed in claim 14, wherein the sacrificial support layer extends across the at least one predetermined scribe line.

16. The method for forming a chip package as claimed in claim 15, wherein the sacrificial support layer covers the at least one conducting pad.

17. The method for forming a chip package as claimed in claim 11, wherein the step of dicing and removing the portion of the protection substrate and the portion of the sacrificial support layer to expose the at least one conducting pad does not comprises dicing and removing a portion of the spacer layer.

18. The method for forming a chip package as claimed in claim 11, wherein before the step of disposing the protection substrate over the surface of the semiconductor substrate, the steps of forming the spacer layer over the protection substrate, and of bonding the spacer layer onto the surface of the semiconductor substrate through an adhesion layer are performed.

19. The method for forming a chip package as claimed in claim 11, wherein before the step of disposing the protection substrate over the surface of the semiconductor substrate, the step of forming the sacrificial support layer over the protection substrate is performed, and there is no adhesion layer disposed between the sacrificial support layer and the surface of the semiconductor substrate.

20. The method for forming a chip package as claimed in claim 19, wherein after the step of dicing and removing the portion of the protection substrate and the portion of the sacrificial support layer, a remaining portion of the sacrificial support layer is no longer fixed over the surface of the semiconductor substrate such that the sacrificial support layer and the semiconductor substrate are separated from each other.

21. The method for forming a chip package as claimed in claim 11, wherein the spacer layer and the sacrificial support layer are simultaneously formed over the protection substrate.