Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
First Claim
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1. A method of connecting a first component or conductor to a second component or conductor in a three-dimensional electronic, electromagnetic or electromechanical component/device comprising the steps of:
- providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer;
depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor;
attaching a first end of the filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity;
placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity;
depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed;
depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity;
depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed; and
removing the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed portion of the second component or conductor.
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Abstract
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
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Citations
38 Claims
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1. A method of connecting a first component or conductor to a second component or conductor in a three-dimensional electronic, electromagnetic or electromechanical component/device comprising the steps of:
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providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer; depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor; attaching a first end of the filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity; placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity; depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed; depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity; depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed; and removing the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed portion of the second component or conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device made by a method comprising the steps of (a) providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer, (b) depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor, (c) attaching a first end of the filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity, (d) placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity, (e) depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed, (f) depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity, (g) depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed, and (h) removing the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed portion of the second component or conductor.
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34. A system for making a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device comprising:
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a three-dimensional printing device; a first machine; a second machine; and wherein (a) the three-dimensional printing device creates a first layer of the substrate material, (b) the first machine places a first component or conductor on or within the first layer, (b) the three-dimensional printing machine deposits a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor, (c) the first machine attaches a first end of a filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity, (d) the second machine places a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity, (e) the three-dimensional printing device deposits a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed, (f) the second machine places the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity, (g) the three-dimensional printing device deposits a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed, (h) the second machine removes the second end of the filament from the second portion of the elongated cavity and places the second end of the filament proximate to the exposed portion of the second component or conductor, and (i) the first machine attaches the second end of the filament to the exposed portion of the second component or conductor. - View Dependent Claims (35, 36, 37, 38)
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Specification