SUPERCAPACITOR STRUCTURES

• US 20140268617A1
• Filed: 09/30/2013
• Published: 09/18/2014
• Est. Priority Date: 03/09/2012
• Status: Active Grant

• Current Assignee: The Paper Battery Company, Inc.
• Original Assignee: The Paper Battery Company, Inc.
• Inventors: SUDANO, Anthony, RICH, Dave, FRIELLO, Renato, MEHTA, Shreefal
• Granted Patent: US 9,564,275 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/10 Multiple hybrid or EDL capacitors, e.g. arrays or modules housings, cases, encapsulations or mountings thereof H01G11/78
• CPC Class Codes: H01G 11/12 Stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/24 characterised by structural features of the materials making up or comprised in the electrodes, e.g. form, surface area or porosity; characterised by the structural features of powders or particles used therefor
• CPC Class Codes: H01G 11/72 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/76 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 2/22 Electrostatic or magnetic shielding
• CPC Class Codes: H01M 10/4264 with capacitors
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs include a multi-contact tab. The multi-contact tab is configured and sized with multiple contact locations which are disposed external to the supercapacitor structure. Various supercapacitor structures are provided, including one supercapacitor structure with a shared C-shaped current collector, and another supercapacitor structure with stacked supercapacitors. One or more additional multi-contact tabs may also extend from the supercapacitor structure(s) and distribute the same or a different capacitor voltage than the multi-contact tab.

Claims

1. A device comprising:

a supercapacitor structure, the supercapacitor structure comprising one or more layers of supercapacitors; and

one or more contact tabs, the one or more contact tabs electrically contacting and extending outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs comprising;

a multi-contact tab, the multi-contact tab being configured and sized with multiple contact locations disposed external to the supercapacitor structure.

2. The device of claim 1, wherein the multi-contact tab is configured and sized to reside over at least a portion of a circuit board assembly to, in part, facilitate electromagnetic interface shielding thereof, the multiple contact locations of the multi-contact tab facilitating multiple electrical connections between the circuit board assembly and the supercapacitor structure.

3. The device of claim 2, wherein the circuit board assembly includes a component having a main surface with a main surface area, and the multi-contact tab comprises a film tab with a surface area at least as large as the main surface area of the main surface of the component.

4. The device of claim 2, wherein the supercapacitor structure is disposed over the circuit board assembly, including over one or more components mounted to the circuit board assembly, and facilitates electromagnetic interference shielding of the one or more components.

5. The device of claim 1, wherein the supercapacitor structure is configured and sized to reside over at least a portion of a main surface of a battery to, in part, facilitate electromagnetic interference shielding of the battery.

6. The device of claim 5, wherein the supercapacitor structure comprises a flexible sheet, and wherein the supercapacitor structure is configured and sized to wrap around and at least partially cover opposing main surfaces of the battery.

7. The device of claim 1, wherein the multi-contact tab comprises a film tab with a surface area greater than a surface area of a main surface of the supercapacitor structure.

8. The device of claim 1, wherein the supercapacitor structure comprises a shared C-shaped current collector and the one or more layers of supercapacitors comprise a first supercapacitor and a second supercapacitor, the first supercapacitor comprising the shared C-shaped current collector, and the second supercapacitor also comprising the shared C-shaped current collector, and wherein the shared C-shaped current collector at least partially encircles the first and second supercapacitors.

9. The device of claim 8, wherein the first and second supercapacitors reside within the shared C-shaped current collector of the supercapacitor structure.

10. The device of claim 9, wherein the multi-contact tab electrically contacts to and extends outward from the shared C-shaped current collector of the supercapacitor structure.

11. The device of claim 8, wherein the first supercapacitor further comprises another current collector and the one or more contact tabs further comprise another multi-contact tab, the another multi-contact tab being configured and sized with multiple contact locations thereto disposed external to the supercapacitor structure, and the another multi-contact tab electrically contacts to the another current collector, and the multi-contact tab is electrically connected to distribute a first voltage, and the another multi-contact tab is electrically connected to distribute a second voltage, wherein the first voltage and second voltage are different voltages.

12. The device of claim 1, wherein the multi-contact tab is configured and sized to provide electromagnetic interference shielding to a majority of an associated circuit board assembly.

13. The device of claim 1, wherein the one or more layers of supercapacitors comprise a first supercapacitor and a second supercapacitor disposed within a stack, the first supercapacitor comprising a shared current collector and a negative current collector, the second supercapacitor comprising the shared current collector and a positive current collector, and wherein the shared current collector resides between the negative and positive current collectors.

14. The device of claim 13, wherein the multi-contact tab electrically contacts to the shared current collector of the first and second supercapacitors in the stack.

15. The device of claim 14, wherein the one or more contact tabs further comprise another multi-contact tab, the another multi-contact tab being configured and sized with multiple contact locations thereto disposed external to the supercapacitor structure, and the another multi-contact tab electrically contacting one of the negative current collector or the positive current collector.

16. The device of claim 15, wherein the multi-contact tab and the another multi-contact tab extend from one of a same side of the supercapacitor structure, or different sides of the supercapacitor structure.

17. The device of claim 13, wherein the multi-contact tab is configured and sized to cover a first portion of one or more circuit board assemblies, and the multiple contact locations of the multi-contact tab facilitate multiple electrical connections between the first portion of the one or more circuit board assemblies and the supercapacitor structure, and the another multi-contact tab is configured and sized to cover a second portion of the one or more circuit board assemblies, and the multiple contact locations of the another multi-contact tab facilitate multiple electrical connections between the second portion of the one or more circuit board assemblies and the supercapacitor structure.

18. The device of claim 13, wherein the multi-contact tab is electrically connected to the supercapacitor to distribute a first voltage, and the another multi-contact tab is electrically connected to the supercapacitor to distribute a second voltage, wherein the first voltage and second voltage are different voltages.

19. The device of claim 1, wherein the one or more layers of supercapacitors of the supercapacitor structure comprise a first supercapacitor and a second supercapacitor, the first supercapacitor being electrically isolated from the second supercapacitor within the supercapacitor structure, and the multi-contact tab being electrically connected to the first supercapacitor.

20. The device of claim 19, wherein the multi-contact tab is a first contact tab and the one or more contact tabs further comprise a second contact tab, the second contact tab being electrically connected to the second supercapacitor of the supercapacitor structure.

21. The device of claim 20, wherein the first contact tab is electrically connected to the first supercapacitor to distribute a first voltage from the supercapacitor structure, and the second contact tab is electrically connected to the second supercapacitor to distribute a second voltage from the supercapacitor structure, wherein the first voltage and second voltage are different voltages.

22. The device of claim 20, wherein the first contact tab electrically connected to the first supercapacitor has a first resistance capacitance (RC) time constant and the second contact tab electrically connected to the second supercapacitor has a second RC time constant, wherein the first RC time constant and the second RC time constant are different RC time constants.

23. A device comprising:

an electronic structure; and

a supercapacitor structure, the supercapacitor structure comprising one or more layers of supercapacitors, wherein the supercapacitor structure comprise a sheet structure configured and sized to overlie at least a portion of the electronic structure to, in part, facilitate electromagnetic shielding of the electronic structure.

24. The device of claim 23, wherein the electronic structure comprises a battery for supplying power to one or more components of an electronic assembly.

25. The device of claim 24, wherein the sheet structure comprises a flexible sheet structure configured and sized to at least partially overlie opposing surfaces of the battery, the main surface of the battery being one surface of the opposing surfaces of the battery.

26. The device of claim 25, further comprising one or more contact tabs, the one or more contact tabs electrically contacting and extending outwards from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, the one or more contact tabs extending out from at least one edge of the flexible sheet structure, and wherein the one or more contact tables comprise a multi-contact tab, the multi-contact tab being configured and sized with multiple contact locations disposed external to the supercapacitor structure.

27. The device of claim 23, wherein the supercapacitor structure is sized and configured to wrap around the electronic structure.

28. The device of claim 27, wherein the supercapacitor structure at least partially overlies opposing surfaces of the electronic structure, and wherein the electronic structure comprises at least one component of an electronic assembly.