RF PUCK

• US 20140269856A1
• Filed: 03/15/2013
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Gianvittorio, John P., Dominski, Frederick A., Milne, Jason G.
• Granted Patent: US 8,982,931 B2
• Time in Patent Office: Days
• US Class Current: 375/219
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/064 using horn or slot aerials slotted waveguides arrays H01Q21/005
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H04B 1/036 Cooling arrangements
• CPC Class Codes: H04B 1/38 Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

Abstract

An RF module including transmitting, receiving, and processing elements, capable of operating in a standalone mode or as part of an array of similar or identical modules. The RF module includes a radiator (205), transmit-receive circuitry (165), a digital receiver-exciter (160), a processor (100), and a data interface (150). The processor is configured to exchange in-phase and quadrature data with other processors in an array, so that, when configured as an array, digital transmit beam forming and receive beam forming are possible.

Claims

1. A radio-frequency (RF) module for use individually or in an integrated system with at least one other RF module, the RF module comprising:

an aperture comprising an antenna element for transmitting or receiving electromagnetic radiation;

a transmit-receive circuit coupled to the antenna element;

a heat exchanger thermally coupled to the transmit-receive circuit;

a synchronization interface for transmitting or receiving a synchronization signal;

a digital receiver-exciter coupled to the transmit-receive circuit, and coupled to the synchronization interface, the digital receiver-exciter configured to obtain digital samples of a received signal, the received signal corresponding to electromagnetic radiation received by the antenna element;

a processor coupled to the digital receiver-exciter; and

a data interface coupled to the processor;

wherein the processor is configured;

to form, from the digital samples of the received signal, in-phase and quadrature data representing the received signal; and

to output the in-phase and quadrature data through the digital interface.

2. The RF module of claim 1, wherein the transmit-receive circuit comprises a low-noise amplifier and a power amplifier.

3. The RF module of claim 1, wherein the heat exchanger comprises cooling channels configured to accommodate a cooling fluid.

4. The RF module of claim 3, wherein the heat exchanger comprises fluid connectors configured to connect the RF module to, and to receive cooling fluid from, another RF module.

5. The RF module of claim 1, wherein the digital receiver-exciter comprises a local oscillator.

6. The RF module of claim 5, wherein the local oscillator is configured to be phase-locked to the synchronization signal.

7. The RF module of claim 6, wherein the local oscillator is configured to be phase-locked to a 10 MHz tone.

8. The RF module of claim 1, wherein the digital receiver-exciter comprises an analog to digital converter.

9. The RF module of claim 1, wherein the digital receiver-exciter comprises two analog to digital converters.

10. The RF module of claim 1, wherein the digital receiver-exciter comprises components fabricated using a silicon-germanium (SiGe) process.

11. The RF module of claim 10, wherein the digital receiver-exciter comprises components fabricated using a three dimensional silicon-germanium (3D SiGe) process.

12. The RF module of claim 1, wherein the data interface comprises an Ethernet interface.

13. The RF module of claim 1, wherein the data interface comprises a wireless interface.

14. The RF module of claim 13, wherein the processor is configured to output image data to an end user client device.

15. The RF module of claim 14, wherein the processor is configured to output image data to a mobile telephone comprising a graphical display.

16. The RF module of claim 1, wherein the processor is configured to combine samples received from the digital receiver-exciter with in-phase and quadrature data received from other RF modules to form intermediate radar data products.

17. The RF module of claim 16, wherein the processor is configured to form intermediate radar data products comprising Doppler filtered data.

18. The RF module of claim 16, wherein the processor is configured to form intermediate radar data products comprising range-compressed data.

19. The RF module of claim 1, wherein the processor comprises a field programmable gate array (FPGA).

20. The RF module of claim 1, wherein the processor comprises an application specific integrated circuit (ASIC).