LED Illuminating Device

• US 20140313740A1
• Filed: 11/15/2012
• Published: 10/23/2014
• Est. Priority Date: 11/17/2011
• Status: Active Grant

• Current Assignee: OSRAM GmbH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Ming, Yusheng, Chen, Peng, Yuan, Haiping, Gui, Hui
• Granted Patent: US 9,360,192 B2
• Time in Patent Office: Days
• US Class Current: 362/308
• CPC Class Codes: B61L 2207/02 using light-emitting diodes [LEDs]
• CPC Class Codes: B61L 5/1845 Optical systems, lenses
• CPC Class Codes: B61L 5/1854 Mounting and focussing of the light source in a lamp, fixing means
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/62 using mixing chambers, e.g. housings with reflective walls
• CPC Class Codes: F21V 13/04 the elements being reflectors and refractors for vehicle rear lights F21S43/40
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An LED illuminating device includes a printed circuit board, at least one LED chip group arranged on the printed circuit board, and a lens assembly, wherein the LED illuminating device further includes a reflector provided between the LED chip group and the lens assembly, wherein the reflector is configured to diffusely reflect light from the LED chip group so that the light is uniformized and emerges in a direction of the lens assembly.

Claims

1. An LED illuminating device, comprising:

a printed circuit board,

at least one LED chip group arranged on the printed circuit board, and

a lens assembly,

wherein the LED illuminating device further comprises a reflector provided between the LED chip group and the lens assembly, wherein the reflector is configured to diffusely reflect light from the LED chip group so that the light is uniformized and emerges in a direction of the lens assembly.

2. The LED illuminating device according to claim 1, wherein the reflector is a plate-shaped body with a via, wherein the via is formed with an accommodation opening for the LED chip group at one side thereof facing the printed circuit board, and formed with a light emergent opening at the other side opposite to the one side, wherein an inner wall of the via forms a diffuse reflective region.

3. The LED illuminating device according to claim 2, wherein the via has a dimension gradually reduced from the accommodation opening to the light emergent opening.

4. The LED illuminating device according to claim 3, wherein the light emergent opening is circular.

5. The LED illuminating device according to claim 3, wherein the LED chip group comprises a primary LED chip group and a redundant LED chip group, wherein the primary LED chip group and the redundant LED chip group comprise two LED chips, respectively, the LED chips are arranged in a square on the printed circuit board, and the LED chips in the same group are arranged at diagonal of the square.

6. The LED illuminating device according to claim 5, wherein the accommodation opening is a square opening that has a dimension bigger than or equal to a dimension of the LED chip group.

7. The LED illuminating device according to claim 2, wherein a projection is provided at the other side of the reflector away from the printed circuit board, and the light emergent opening is opened on the projection.

8. The LED illuminating device according to claim 1, wherein the LED illuminating device further comprises an attachment lens provided between the reflector and the lens assembly.

9. The LED illuminating device according to claim 8, wherein the attachment lens has a microlens array including a plurality of microlenses which are in a honeycomb arrangement, wherein respective microlens is a spherical lens.

10. The LED illuminating device according to claim 1, wherein the lens assembly comprises a first Fresnel lens and a second Fresnel lens arranged in sequential in a light emerging direction.

11. The LED illuminating device according to claim 1, wherein the reflector is made from a PC material.