SEMICONDUCTOR PACKAGE

  • US 20140319662A1
  • Filed: 04/24/2014
  • Published: 10/30/2014
  • Est. Priority Date: 04/26/2013
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a package substrate which comprises a power supply region and an interconnection region around the power supply region;

    a plurality of ground terminals and a plurality of power terminals, which are disposed in the power supply region with a dielectric interposed between the ground terminals and the power terminals, wherein the ground terminals and the power terminals extend from a top surface of the package substrate to a bottom surface of the package substrate; and

    at least one semiconductor chip mounted on the package substrate comprising a plurality of ground pads which are commonly connected to a ground terminal of the ground terminals and a plurality of power pads which are commonly connected to a power terminal of the power terminals.

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