Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units
First Claim
1. A method of making a semiconductor device, comprising:
- providing a plurality of interconnect structures;
disposing an encapsulant over the interconnect structures;
singulating through the encapsulant between the interconnect structures to form a modular interconnect unit; and
disposing a semiconductor die in a peripheral region of the modular interconnect unit.
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0 Petitions
Accused Products
Abstract
A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted over the carrier and around or in a peripheral region around the semiconductor die such that the modular interconnect unit is offset from the back surface of the semiconductor die. An encapsulant is deposited over the carrier, semiconductor die, and modular interconnect unit. A first portion of the encapsulant is removed to expose the semiconductor die and a second portion is removed to expose the modular interconnect unit. The carrier is removed. An interconnect structure is formed over the semiconductor die and modular interconnect unit. The modular interconnect unit includes a vertical interconnect structures or bumps through the semiconductor device. The modular interconnect unit forms part of an interlocking pattern around the semiconductor die.
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Citations
25 Claims
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1. A method of making a semiconductor device, comprising:
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providing a plurality of interconnect structures; disposing an encapsulant over the interconnect structures; singulating through the encapsulant between the interconnect structures to form a modular interconnect unit; and disposing a semiconductor die in a peripheral region of the modular interconnect unit. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making a semiconductor device, comprising:
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providing a substrate; forming an interconnect structure through the substrate; singulating through the substrate to form a modular interconnect unit; and disposing a semiconductor die in a peripheral region of the modular interconnect unit. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A semiconductor device, comprising:
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a modular interconnect unit; an interconnect structure formed through the modular interconnect unit; and a semiconductor die disposed in a peripheral region of the modular interconnect unit. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A semiconductor device, comprising:
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a modular interconnect unit; and a semiconductor die disposed in a peripheral region of the modular interconnect unit. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification