APPARATUS AND METHOD FOR DISSIPATING HEAT

• US 20140321058A1
• Filed: 04/30/2013
• Published: 10/30/2014
• Est. Priority Date: 04/30/2013
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Aono, Tatsuhito, FUJIEDA, Tadaomi
• Granted Patent: US 9,307,682 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/2099 Liquid coolant with phase change
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.

Claims

1. An apparatus comprising:

a display including a frame disposed at a bottom surface of the display;

a semiconductor chip; and

a first heat pipe affixed to the frame, the first heat pipe being comprised of a thermally conductive material, wherein

a surface of the first heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip.

2. The apparatus of claim 1, wherein

the predetermined distance is based on a thermal radiation radius corresponding to the semiconductor chip.

3. The apparatus of claim 1, wherein

the first heat pipe includes at least one flat surface.

4. The apparatus of claim 1, wherein:

a surface of the frame includes a recess portion, and

the first heat pipe is arranged within the recess.

5. The apparatus of claim 1, wherein:

a shield is formed over the semiconductor chip, and

the first heat pipe contacts the shield.

6. The apparatus of claim 5, wherein

the first heat pipe contacts the shield within a recess formed on a surface of the shield.

7. The apparatus of claim 5, wherein

a conductive sheet is interposed between the first heat pipe and the shield.

8. The apparatus of claim 1, wherein

a plurality of heat pipes are affixed to the frame.

9. The apparatus of claim 8, wherein

the plurality of heat pipes are arranged at a predetermined spacing interval on a surface of the frame.

10. The apparatus of claim 9, wherein

at least one heat pipe, of the plurality of heat pipes, is arranged on the surface of the frame in a perpendicular direction relative to the plurality of heat pipes arranged at the predetermined spacing interval.

11. The apparatus of claim 1, wherein

the first heat pipe has a non-linear shape.

12. The apparatus of claim 11, wherein

the first heat pipe bends from a centerline of a surface of the frame to an outer edge of the frame.

13. The apparatus of claim 1, wherein

a liquid is enclosed within the first heat pipe, and

the first heat pipe includes a high temperature region configured to collect steam generated in response to heating the liquid.

14. The apparatus of claim 13, wherein:

the first heat pipe includes a low temperature region configured to collect condensed steam from the high temperature region, and

the low temperature region is connected to the high temperature region such that the condensed steam flows from the low temperature region to the high temperature region.

15. The apparatus of claim 1, further comprising:

a battery; and

a second heat pipe affixed to a cover of the battery.

16. The apparatus of claim 15, wherein:

the battery includes a recess having a size corresponding to a size of the second heat pipe, and

the recess is arranged on the battery to correspond to a location at which the second heat pipe is affixed to the cover of the battery.

17. The apparatus of claim 16, wherein

the recess is arranged on the battery such that a positive electrode and a negative electrode of the battery are split in two or more parts.

18. The apparatus of claim 15, wherein

the second heat pipe contacts a shield formed over the semiconductor chip.

19. The apparatus of claim 15, further comprising

one or more circuit boards interposed between the battery and the frame.

20. A method of dissipating heat from a semiconductor chip in a mobile device, the method comprising:

affixing a heat pipe to a frame disposed at a bottom surface of a display included on the mobile device; and

dissipating heat generated by the semiconductor chip by arranging the heat pipe such that a surface of the heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip, wherein

the heat pipe is comprised of a thermally conductive material.

21. An apparatus comprising:

a display including a frame disposed at a bottom surface of the display;

a semiconductor chip; and

a heat dissipation means for dissipating heat from the semiconductor chip, wherein

the heat dissipation means is affixed to the frame,

the heat dissipation means is comprised of a thermally conductive material, and

a surface of the heat dissipation means opposes the semiconductor chip at a predetermined distance from the semiconductor chip.