HOLD DOWN FOR RETAINING A HEAT SINK

• US 20140321064A1
• Filed: 11/21/2012
• Published: 10/30/2014
• Est. Priority Date: 11/21/2011
• Status: Active Grant

• Current Assignee: InterDigital Patent Holdings, Inc. (InterDigital, Inc.)
• Original Assignee: Thomson Licensing (Vantiva SA)
• Inventors: Bose, William Hofmann, Hunt, Mickey Jay
• Granted Patent: US 9,907,208 B2
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: F16M 13/02 for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.

Claims

1. A hold down for an electronic device that includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad, wherein the hold down comprises:

a generally planar portion adapted to be positioned over a surface of the heat sink; and

a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply a biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame.

2. The hold down of claim 1, wherein the support frame comprises a bottom frame.

3. The hold down of claim 1, wherein the hold down is a unitary structure formed of sheet metal.

4. The hold down of claim 1, wherein the connecting structures comprise an aperture configured to engage with one or more extensions protruding from the support frame.

5. The hold down of claim 1, wherein:

the connecting structures extend angularly from ends of the generally planar portion, and

the generally planar portion is configured such that, in its free state, the ends of the generally planar portion are bowed away from a direction in which the connecting structures extend.

6. The hold down of claim 1, wherein the heat sink includes grooves for receiving the generally planar portion.

7. The hold down of claim 1, wherein the electronic device comprises a set top box.

8. The hold down of claim 1, wherein the generally planar portion is configured to engage with a plurality of mating locations defined on the support frame to allow the generally planar portion to apply the biasing force.

9. An electronic device comprising:

a support frame;

a circuit board coupled to the support frame and having at least one component;

a thermal pad thermally coupled to the component;

a heat sink associated with the thermal pad; and

a hold down for providing a biasing force against the heat sink, wherein the hold down comprises;

a generally planar portion adapted to be positioned over a surface of the heat sink; and

a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame.

10. The electronic device of claim 9, wherein the support frame comprises a bottom frame.

11. The electronic device of claim 9, wherein the hold down is a unitary structure formed of sheet metal.

12. The electronic device of claim 9, wherein the connecting structures comprise an aperture configured to engage with one or more extensions protruding from the support frame.

13. The electronic device of claim 9, wherein:

the connecting structures extend angularly from ends of the generally planar portion, and

the generally planar portion is configured such that, in its free state, the ends of the generally planar portion are bowed away from a direction in which the connecting structures extend.

14. The electronic device of claim 9, wherein the heat sink includes grooves for receiving the generally planar portion.

15. The electronic device of claim 9, wherein the electronic device is a set top box.

16. The electronic device of claim 9, wherein the generally planar portion is configured to engage with a plurality of mating locations defined on the support frame to allow the generally planar portion to apply the biasing force.

17. The electronic device of claim 9, wherein the thermal pad forms a unitary structure with one or more of the heat sink or the component.

18. A method comprising:

accessing a hold down for an electronic device, the electronic device including a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad, wherein the hold down includes;

a generally planar portion adapted to be positioned over a surface of the heat sink; and

a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame; and

attaching a first of the connecting structures to a first mating location defined on the support frame; and

attaching a second of the connecting structures to a second mating location defined on the support frame, wherein the generally planar portion is configured to engage with the first and second mating locations to cause the hold down to apply the biasing force.

19. The method of claim 19, wherein:

the connecting structures comprise an aperture configured to engage with one or more extensions protruding from the support frame,

attaching the first of the connecting structures comprises placing the aperture of the first connecting structure over one or more extensions of the support frame, and

attaching the second of the connecting structures comprises placing the aperture of the second connecting structure over one or more additional extensions of the support frame.

20. The method of claim 19, wherein:

the connecting structures extend angularly from ends of the generally planar portion,

the generally planar portion is configured such that, in its free state, the ends of the generally planar portion are bowed away from a direction in which the connecting structures extend, and

attaching the second of the connecting structures comprises applying pressure to the second connecting structure to straighten out the bow of the generally planar portion.