ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD FOR ANTENNA

• US 20140333484A1
• Filed: 08/04/2011
• Published: 11/13/2014
• Est. Priority Date: 05/13/2011
• Status: Active Grant

• Current Assignee: Shuhou Co., Ltd.
• Original Assignee: Shuhou Co., Ltd.
• Inventors: Muraoka, Kouji
• Granted Patent: US 9,520,644 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/27 Adaptation for use in or on movable bodies H01Q1/08, H01Q1/12, H01Q1/18 take precedence
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/364 using a particular conducting material, e.g. superconductor
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H05K 2201/0266 Size distribution
• CPC Class Codes: H05K 2203/0709 Catalytic ink or adhesive for electroless plating catalyst filler H05K2201/0236
• CPC Class Codes: H05K 3/18 using precipitation techniques to apply the conductive material
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/246 Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Abstract

This antenna (10) has an underlying print layer (2) which is upon the surface of a material (1) to be printed in a predetermined antenna pattern, and an electro-less plating layer (3) applied to the surface of the underlying print layer (2). The underlying print layer (2) is formed from an ink (2a) and a metallic powder (2b). A portion of the particles of the metallic powder (2b) are entrained within the ink layer in which the ink (2a) has been printed in a substantially uniform thickness. Some particles which are of large particle size project from the ink layer, and a portion of the ink (2a) covering the projecting portions is removed.

Claims

1. An antenna comprising:

a base print layer printed in a predetermined antenna pattern on a workpiece, the base print layer being formed of an ink containing a plurality of metal particles having a predetermined particle diameter distribution; and

an electroless plating layer disposed on a surface of the base print layer, wherein,

some of particles of the metal particles are buried in an ink layer forming the base print layer, some of the particles of the metal particles are protrudent from the ink layer forming the base print layer, and part of the ink covering the protrudent portions have been removed.

2. The antenna of claim 1, wherein the metal particles are contained in the ink with a proportion by volume of 30 to 70%.

3. The antenna of claim 1, wherein the electroless plating layer is formed of Cu, and an electroless Ni plating layer is disposed on a surface of the electroless Cu plating layer.

4. The antenna of claim 3, wherein an electroless Au plating layer is disposed on a surface of the electroless Ni plating layer.

5. The antenna of claim 1, wherein,

the metal particles are any of Cu, Ni, Fe, Mg, Pd, Ag, Au and C, or an alloy of any of Cu, Ni, Fe, Mg, Pd, Ag and Au, and

particle diameters of approximately 95% of the metal particles are distributed in the range from 0.04 to 50 μ

m, and the particle diameters of approximately 40% of the metal particles are distributed in the range from 5 to 30 μ

m.

6. A communication device comprising the antenna of claim 1.

8. The antenna of claim 2, wherein the electroless plating layer is formed of Cu, and an electroless Ni plating layer is disposed on a surface of the electroless Cu plating layer.

9. The antenna of claim 4, wherein an electroless Au plating layer is disposed on a surface of the electroless Ni plating layer.

10. The antenna of claim 2, wherein,

the metal particles are any of Cu, Ni, Fe, Mg, Pd, Ag, Au and C, or an alloy of any of Cu, Ni, Fe, Mg, Pd, Ag and Au, and

particle diameters of approximately 95% of the metal particles are distributed in the range from 0.04 to 50 μ

m, and the particle diameters of approximately 40% of the metal particles are distributed in the range from 5to 30 μ

m.

11. A communication device comprising the antenna of claim 2.

7. An antenna manufacturing method comprising:

a printing step of forming a base print layer in a predetermined antenna pattern on a workpiece with an ink containing a plurality of metal particles having a predetermined particle diameter distribution;

an ink removing step of removing, from those of the metal particles being protrudent from an ink layer forming the base print layer, part of the ink covering the portions protrudent from the ink layer; and

an electroless plating step of forming an electroless plating layer on a surface of the base print layer.