SYSTEM AND METHODS FOR THERMAL CONTROL USING SENSORS ON DIE

• US 20140334107A1
• Filed: 05/09/2013
• Published: 11/13/2014
• Est. Priority Date: 05/09/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: COX, Keith, HERESZTYN, Amaury J., CHOWDHURY, Ihtesham H.
• Granted Patent: US 9,285,278 B2
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence

Abstract

A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.

Claims

1. A portable electronic device comprising:

a printed circuit board (PCB);

a die including an integrated circuit (IC), the die embedded in the PCB;

a temperature sensor included in the die;

a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor; and

a memory circuit coupled to the processor circuit and the temperature sensor, the memory circuit configured to store a temperature gradient provided by the temperature sensor.

2. The portable electronic device of claim 1 wherein the IC in the die is inactive.

3. The portable electronic device of claim 1 wherein the IC is a Power Amplifier (PA) for a radio-frequency (RF) antenna.

4. The portable electronic device of claim 1 wherein the IC is proximal to a thermal component in the PCB.

5. The portable electronic device of claim 4 wherein the thermal component is a battery.

6. The portable electronic device of claim 4 wherein the thermal component is a window.

8. The PCB of claim 5 further comprising a thermal component.

7. A Printed Circuit Board (PCB) for use in a portable electronic device, the PCB comprising:

a die including an integrated circuit (IC), the die embedded in the PCB;

a temperature sensor included in the die;

a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor; and

a memory circuit coupled to the processor circuit and the temperature sensor, the memory circuit configured to store a temperature gradient provided by the temperature sensor.

9. The PCB of claim 7 wherein the IC in the die is inactive.

10. The PCB of claim 7 wherein the IC is a Power Amplifier (PA) for a radio-frequency (RF) antenna.

11. The PCB of claim 7 wherein the IC is proximal to a thermal component in the PCB.

12. The PCB of claim 7 wherein the thermal component is a battery.

13. The PCB of claim 7 wherein the thermal component is a window.

14. A method for performing thermal control in a portable electronic device, the method comprising:

simulating a temperature gradient of an area of interest in a Printed Circuit Board (PCB);

selecting a temperature sensor;

collecting the temperature sensor reading;

obtaining a measurement of the temperature gradient of the area of interest; and

performing a remedial action in the area of interest.

15. The method of claim 14 wherein selecting a temperature sensor comprises selecting a sensor in an inactive Integrated Circuit (IC).

16. The method of claim 14 wherein collecting the temperature sensor reading comprises collecting a plurality of temperature sensor readings from a plurality of ICs in the PCB.

17. The method of claim 16 further comprising performing a statistical operation from the plurality of temperature sensor readings.

18. The method of claim 17 further comprising removing from the plurality of temperature sensor readings one of the group consisting of a highest temperature sensor reading, a lowest temperature sensor reading, and a highest and a lowest temperature sensor reading.

19. The method of claim 18 wherein performing a remedial action in the area of interest comprises turning ‘

off’

an IC embedded in the PCB.

20. The method of claim 14 wherein performing a remedial action in the area of interest comprises setting an IC in ‘

sleep’

mode.