SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• US 20140346659A1
• Filed: 08/08/2014
• Published: 11/27/2014
• Est. Priority Date: 03/28/2012
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: NAKAMURA, Hideyo, HORIO, Masafumi
• Granted Patent: US 9,385,061 B2
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/043 the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/10272 Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1421 RF devices
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 : specially adapted for the configuration of power bus bars
• CPC Class Codes: H05K 7/209 : Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules.

Claims

1. A semiconductor device comprising:

a plurality of semiconductor modules, each of the plurality of semiconductor modules comprising a circuit board having at least one or more semiconductor chips mounted thereon, an attachment hole, a heat dissipation portion exposed at one end portion of the attachment hole, and a protruding connection terminal;

main terminal plates that connect connection terminals of the plurality of semiconductor modules and form an electrical conduction path connecting semiconductor circuits in the semiconductor module; and

a module storage case accommodating the plurality of semiconductor modules such that positions of the semiconductor modules are adjustable and comprising insertion holes, through which a portion of each of the main terminal plates is drawn as a main terminal segment, and attachment insertion holes facing the attachment holes of the semiconductor modules.

2. The semiconductor device according to claim 1, wherein:

the plurality of semiconductor modules are individually accommodated in parallel in a module storage region of the module storage case, and the main terminal plates are accommodated in a terminal plate storage region connected to the module storage region, and

the module storage region comprises guide protrusions that guide the side surfaces of the semiconductor modules and define individual storage regions for accommodating the plurality of semiconductor modules.

3. The semiconductor device according to claim 1, wherein a width of the module storage region is configured such that the module storage region accommodates and holds the semiconductor modules with a gap between immediately adjacent semiconductor modules.

4. The semiconductor device according to claim 2,

wherein the guide protrusion comprises, at its leading end, a fitting convex portion that is fitted to a fitting groove disposed in the side surface of the semiconductor module.

5. The semiconductor device according to claim 2,

wherein the module storage case is flexible, and

a snap-fitting protrusion disposed in the module storage region is fitted to a snap-fitting concave portion disposed in the semiconductor module.

6. The semiconductor device according to claim 2,

further comprising an insulating partition wall insulating the main terminal plates and disposed in the terminal plate storage region.

7. The semiconductor device according to claim 2,

wherein the module storage case accommodates the plurality of semiconductor modules, with the heat dissipation portion facing the opening portion, and

fixing tools are disposed in the attachment holes of the semiconductor modules through the attachment insertion holes, with the heat dissipation portion contacted with a cooler, to fix each of the accommodated plurality of semiconductor modules to the cooler.

8. The semiconductor device according to claim 2,

wherein, in the module storage case, the attachment insertion hole is formed in an inner circumferential surface of a cylindrical portion that is fitted to the attachment hole of the semiconductor module.

9. The semiconductor device according to claim 2,

wherein the main terminal plate comprises:

a terminal plate body extending so as to traverse the plurality of semiconductor modules and having a plate surface parallel to the attachment hole;

a bending plate portion provided on one of end surfaces perpendicular to the longitudinal direction of the terminal plate body and serving as the main terminal segment; and

a connection terminal holding portion disposed at the other end surface so as to protrude therefrom and comprising insertion holes into which the connection terminals of the plurality of semiconductor modules are inserted.

10. The semiconductor device according to claim 9,

wherein the connection terminal holding portion comprises a plurality of flexible connection pieces formed as protrusions at positions corresponding to the connection terminals of the plurality of semiconductor modules.

11. The semiconductor device according to claim 9,

wherein the bending plate portion protrudes from the module storage case and is bent so as to face a nut stored in a nut storage concave portion disposed in an outer surface of the terminal plate storage region to form the main terminal segment, and

the bending plate portion comprises an insertion hole facing a female screw of the nut and having a larger inside diameter than that of the female screw.

12. A method for manufacturing a semiconductor device in which a plurality of semiconductor modules, each of the plurality of semiconductor modules comprising a circuit board having at least one or more semiconductor chips mounted thereon and an attachment hole, are arranged and held in a module storage case, the method comprising:

inserting a main connection terminal protruding from each of the plurality of semiconductor modules into an insertion hole of a connection terminal holding portion formed in a main terminal plate traversing the plurality of semiconductor modules, with the plurality of semiconductor modules arranged in parallel, and fixing the main connection terminal and the connection terminal holding portion to form a module aggregate;

accommodating and holding the module aggregate in the module storage case such that a bending plate portion of the main terminal plate protrudes toward the outside through an attachment insertion hole of the module storage case, the position of the semiconductor modules being adjustable during attachment, thereby forming a semiconductor device; and

mounting the module storage case on a cooler and inserting fixing tools into the attachment holes of the plurality of semiconductor modules through insertion holes disposed in the module storage case, thereby fixing each of the accommodated plurality of semiconductor modules to the cooler.

13. The method for manufacturing a semiconductor device according to claim 12,

wherein the bending plate portion of the main terminal plate is bent to cover a nut that is inserted into a nut insertion concave portion disposed in an outer surface of a main terminal plate storage region of the module storage case when the semiconductor device is formed or after the semiconductor device is mounted on the cooler.