SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

  • US 20140353810A1
  • Filed: 09/11/2013
  • Published: 12/04/2014
  • Est. Priority Date: 05/28/2013
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device comprising:

  • a semiconductor substrate having a first main surface and a second main surface and including a predetermined element formed on the first main surface and a plurality of through silicon vias (TSVs) configured to electrically connect a plurality of wirings formed on the first main surface to a plurality of electrodes correspondingly formed on the second main surface;

    a conductive cover configured to cover the first main surface of the semiconductor substrate; and

    a conductive bonding member configured to bond the conductive cover and one wiring of the wirings formed on the first main surface of the semiconductor substrate to each other.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×