ELECTRONIC SYSTEM WITH HEAT EXTRACTION AND METHOD OF MANUFACTURE THEREOF

• US 20140376190A1
• Filed: 06/19/2013
• Published: 12/25/2014
• Est. Priority Date: 06/19/2013
• Status: Active Grant

• Current Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Original Assignee: Smart Storage Systems Incorporated (Western Digital Corporation)
• Inventors: Dean, David Lee, Ellis, Robert W.
• Granted Patent: US 9,313,874 B2
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

Claims

1. A method of manufacture of an electronic system comprising:

providing a substrate;

mounting an electrical device over the substrate; and

mounting a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

2. The method as claimed in claim 1 wherein mounting the surface mount heat sink includes attaching the surface mount heat sink to an external layer and the substrate with the electrical device isolated from the external layer.

3. The method as claimed in claim 1 wherein:

mounting the electrical device includes mounting the electrical device directly over a thermal pad of the substrate; and

mounting the surface mount heat sink includes mounting the surface mount heat sink directly over the thermal pad.

4. The method as claimed in claim 1 wherein mounting the surface mount heat sink includes mounting the surface mount heat sink having a base portion and a non-horizontal portion, the base portion attached to the substrate, the non-horizontal portion substantially perpendicular to the base portion.

5. The method as claimed in claim 1 wherein mounting the surface mount heat sink includes mounting the surface mount heat sink for providing a pathway for electro static discharge (ESD), the surface mount heat sink having a base portion, a non-horizontal portion, and a top portion, the base portion attached to the substrate, the top portion substantially parallel to the base portion, the non-horizontal portion substantially perpendicular to the top portion.

6. A method of manufacture of an electronic system comprising:

providing a substrate;

mounting an electrical device over the substrate; and

mounting a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape with a uniform cross-section and a fixed length, the extruded shape characteristic of being formed using an extrusion mechanism.

7. The method as claimed in claim 6 wherein mounting the surface mount heat sink includes attaching the surface mount heat sink to an external layer and the substrate with the electrical device isolated from the external layer, whereby the external layer is a case or a printed circuit board.

8. The method as claimed in claim 6 wherein:

mounting the electrical device includes mounting the electrical device directly over a thermal pad of the substrate; and

mounting the surface mount heat sink includes mounting the surface mount heat sink directly over the thermal pad, the surface mount heat sink attached to the thermal pad.

9. The method as claimed in claim 6 wherein mounting the surface mount heat sink includes mounting the surface mount heat sink having a base portion, a non-horizontal portion, and a top portion, the base portion attached to the substrate, the non-horizontal portion substantially perpendicular to the base portion and the top portion.

10. The method as claimed in claim 6 wherein mounting the surface mount heat sink includes mounting the surface mount heat sink having a base portion, a first non-horizontal portion, and a second non-horizontal portion, the base portion attached to the substrate, the first non-horizontal portion and the second non-horizontal portion at an angle less than 90 degrees from the base portion.

11. An electronic system comprising:

a substrate;

an electrical device over the substrate; and

a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

12. The system as claimed in claim 11 wherein the surface mount heat sink is attached to an external layer and the substrate with the electrical device isolated from the external layer.

13. The system as claimed in claim 11 wherein:

the electrical device is directly over a thermal pad of the substrate; and

the surface mount heat sink is directly over the thermal pad.

14. The system as claimed in claim 11 wherein the surface mount heat sink includes a base portion and a non-horizontal portion, the base portion attached to the substrate, the non-horizontal portion substantially perpendicular to the base portion.

15. The system as claimed in claim 11 wherein the surface mount heat sink is for providing a pathway for electro static discharge (ESD), the surface mount heat sink includes a base portion, a non-horizontal portion, and a top portion, the base portion attached to the substrate, the top portion substantially parallel to the base portion, the non-horizontal portion substantially perpendicular to the top portion.

16. The system as claimed in claim 11 wherein the surface mount heat sink includes a uniform cross-section and a fixed length.

17. The system as claimed in claim 16 wherein the surface mount heat sink is attached to an external layer and the substrate with the electrical device isolated from the external layer, whereby the external layer is a case or a printed circuit board.

18. The system as claimed in claim 16 wherein:

the electrical device is directly over a thermal pad of the substrate; and

the surface mount heat sink is directly over and attached to the thermal pad.

19. The system as claimed in claim 16 wherein the surface mount heat sink includes a base portion, a non-horizontal portion, and a top portion, the base portion attached to the substrate, the non-horizontal portion substantially perpendicular to the base portion and the top portion.

20. The system as claimed in claim 16 wherein the surface mount heat sink includes a base portion, a first non-horizontal portion, and a second non-horizontal portion, the base portion attached to the substrate, the first non-horizontal portion and the second non-horizontal portion at an angle less than 90 degrees from the base portion.