MULTILAYER PRINTED CIRCUIT BOARD HAVING ANISOTROPY CONDICTIVE FILM AND METHOD FOR MANUFACTURING SAME

• US 20150000959A1
• Filed: 06/27/2014
• Published: 01/01/2015
• Est. Priority Date: 06/27/2013
• Status: Abandoned Application

• Current Assignee: Zhen Ding Technology Co. Ltd
• Original Assignee: Zhen Ding Technology Co. Ltd
• Inventors: SU, WEI-SHUO
• Application Number:
  US14/317,137
• Publication Number:
  US 20150000959A1
• Time in Patent Office: Days
• US Class Current: 174/251
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A multilayer printed circuit board (PCB) includes a first and second PCB component, and an anisotropic conductive film (ACF). The first PCB component includes a first base isolative layer, additional circuited layers and isolative layers alternately stacked on the first base isolative layer, and a number of conductive posts protruding out of the first base isolative layer away from the additional circuited layers and the isolative layers. The second PCB component includes a second base isolative layer, additional circuited layers and isolative layers alternately stacked on the second base isolative layer, and a number of pads are formed on the second base isolative layer opposite to the additional layers and the isolative layers. Each conductive post is aligned with one of the pads. The ACF is sandwiched between and bonds the first base isolative layer and the second base isolative layer together.

Claims

1. A multilayer printed circuit board (PCB) comprising:

a first PCB component comprising a first base isolative layer, a first base circuited layer built on the first base isolative layer, and a plurality of conductive posts, the first base isolative layer defining a plurality of through holes therethrough, each conductive post being inserted through one of the through holes, the conductive posts connecting the first circuited layer and protruding out of the first base isolative layer;

a second PCB component comprising a second base isolative layer, a second base circuited layer built on the first base isolative layer, a plurality of pads forms on the second base isolative layer opposite to the second base circuited layer, and a plurality of vias extending through the second base isolative layer and connecting the pads with the second base circuited layer, each conductive post being aligned with one of the pads; and

an anisotropic conductive film sandwiched between the first base isolative layer and the second base isolative layer and bonding the first base isolative layer and the second base isolative layer together;

wherein each conductive post tapers from an end that contacts the first base circuited layer to another end.

2. The multilayer PCB of claim 1, wherein the first PCB component comprises additional isolative layers and circuited layers alternately stacked on the first base circuited layer.

3. The multilayer PCB of claim 2, wherein the first PCB component comprises additional vias for interconnecting each two adjacent additional circuited layers.

4. The multilayer PCB of claim 1, wherein second PCB component comprises additional isolative layers and circuited layers alternately stacked on the second base circuited layer.

5. The multilayer PCB of claim 4, wherein the second PCB component comprises additional vias for interconnecting each two adjacent additional circuited layers.

6. The multilayer PCB of claim 1, wherein the first base isolative layer comprises a first surface and a second surface opposite to the first surface, the first base circuited layer is stacked on the first surface, each through hole forms a first opening in the first surface and a second opening in the second surface, and the first opening is larger than the second opening.

7. The multilayer PCB of claim 6, wherein each through hole tapers from the first opening towards the second opening.

8. A method for manufacturing a multilayer PCB, comprising:

providing a first PCB component comprising a first base isolative layer, a first base circuited layer built on the first base isolative layer, and a plurality of conductive posts, the first base isolative layer defining a plurality of through holes therethrough, each conductive post being inserted through one of the through holes, the conductive posts connecting the first circuited layer and protruding out of the first base isolative layer;

providing a second PCB component comprising a second base isolative layer, a second base circuited layer built on the first base isolative layer, a plurality of pads formed on the second base isolative layer opposite to the second base circuited layer, and a plurality of vias extending through the second base isolative layer and connecting the pads with the second base circuited layer, each conductive post being aligned with one of the pads; and

providing an anisotropic conductive film sandwiched between and bonding the first base isolative layer and the second base isolative layer together.

9. A method for manufacturing a multilayer printed circuit board (PCB), comprising:

providing a first PCB component comprising a first base isolative layer, a first base circuited layer built on the first base isolative layer, and a plurality of conductive posts, the first base isolative layer defining a plurality of through holes therethrough, each conductive post being inserted through one of the through holes, the conductive posts connecting the first circuited layer and protruding out of the first base isolative layer;

providing a second PCB component comprising a second base isolative layer, a second base circuited layer built on the first base isolative layer, a plurality of pads formed on the second base isolative layer opposite to the second base circuited layer, and a plurality of vias extending through the second base isolative layer and connecting the pads with the second base circuited layer, each conductive post being aligned with one of the pads;

sandwiching an anisotropic conductive film between the first base isolative layer and the second base isolative layer, the anisotropic conductive film including an adhesive layer and conductive particles dispersed in the adhesive layer; and

thermally pressing the first PCB component and the second PCB component towards each other until the anisotropic conductive film is deformed and the conductive posts protruding out of the first base isolative layer become electrically connected to their respective aligned ones of the aligned pads of the second PCB component through some of the conductive particles, which are located between the conductive posts protruding out of the first base isolative layer and their respective aligned ones of the aligned pads of the second PCB component, and the first PCB component becomes bonded to the second PCB component by the adhesive layer of the anisotropic conductive film.