SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
First Claim
1. A semiconductor device comprising:
- a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins;
an insulation layer formed on the second major plane of the base plate;
a circuit pattern fixed to the insulation layer;
a semiconductor element connected to the circuit pattern; and
a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element, whereinthe bulge portion formed on the first major plane continuously encircles the plurality of fins,the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, andthe sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.
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Accused Products
Abstract
The purpose is to provide a fin-integrated type semiconductor device that is a simple structure and has a high heat dissipating characteristic, and to provide a manufacturing method therefor. The semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first plane and a bulge portion formed thereon to encircle the plurality of fins; an insulation layer formed on the second major plane of the base plate; a circuit pattern fixed to the insulation layer; a semiconductor element connected to the circuit pattern; and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins.
12 Citations
10 Claims
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1. A semiconductor device comprising:
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a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins; an insulation layer formed on the second major plane of the base plate; a circuit pattern fixed to the insulation layer; a semiconductor element connected to the circuit pattern; and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element, wherein the bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 10)
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9. A method of manufacturing a semiconductor device, comprising steps of:
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forming integrally a base plate having a plurality of fins held upright on the base plate and a bulge portion formed on the base plate to encircle continuously the plurality of fins and to have a widthwise margin on an outer peripheral edge of the base plate; fixing a semiconductor element to the base plate; injecting a molding resin into the molding die in which the base plate is placed; and curing the injected molding resin by heating.
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Specification