PLASMA PROCESSING APPARATUS AND OPERATIONAL METHOD THEREOF
First Claim
1. A plasma processing apparatus, comprising:
- a processing chamber which is disposed inside a vacuum vessel;
a detector which is configured to detect a change in an intensity of light emission from plasma formed inside the processing chamber; and
an adjusting unit which is configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, whereinthe detector detects a signal of the intensity of light emission at a plurality of time instants before an arbitrary time instant during processing, and whereinthe adjusting unit removes a component of a temporal change of a long cycle of the intensity of light emission from this detected signal and detects a component of a short temporal change of the intensity of light emission, and further adjusts the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission.
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Accused Products
Abstract
A plasma processing apparatus includes: a detector configured to detect a change in an intensity of light emission from plasma formed inside a processing chamber; and a unit configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, wherein the detector detects a signal of the intensity of light emission at plural time instants before an arbitrary time instant during processing, and wherein the adjusting unit removes the component of a temporal change of a long cycle of the intensity of light emission from this detected signal and detects the component of a short temporal change of the intensity of light emission, and adjusts the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission.
10 Citations
10 Claims
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1. A plasma processing apparatus, comprising:
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a processing chamber which is disposed inside a vacuum vessel; a detector which is configured to detect a change in an intensity of light emission from plasma formed inside the processing chamber; and an adjusting unit which is configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, wherein the detector detects a signal of the intensity of light emission at a plurality of time instants before an arbitrary time instant during processing, and wherein the adjusting unit removes a component of a temporal change of a long cycle of the intensity of light emission from this detected signal and detects a component of a short temporal change of the intensity of light emission, and further adjusts the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission. - View Dependent Claims (2, 3, 4, 5)
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6. A method for operating a plasma processing apparatus comprising:
- a processing chamber arranged inside a vacuum vessel;
a detector configured to detect a change in an intensity of light emission from plasma formed inside the processing chamber; and
a unit configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, the method comprising the steps of;detecting, by the detector, a signal of the intensity of light emission at a plurality of time instants before an arbitrary time instant during processing; removing the component of a temporal change of a long cycle of the intensity of light emission from the detected signal and detecting a component of a short temporal change of the intensity of light emission; and adjusting the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission. - View Dependent Claims (7, 8, 9, 10)
- a processing chamber arranged inside a vacuum vessel;
Specification