Method For Manufacturing A Printed Circuit Board, Printed Circuit Board And Rear View Device

• US 20150043188A1
• Filed: 08/06/2014
• Published: 02/12/2015
• Est. Priority Date: 08/07/2013
• Status: Abandoned Application

• Current Assignee: SMR Patents Sarl (SMR Patents)
• Original Assignee: SMR Patents Sarl (SMR Patents)
• Inventors: Herrmann, Andreas
• Application Number:
  US14/452,640
• Publication Number:
  US 20150043188A1
• Time in Patent Office: Days
• US Class Current: 361/803
• CPC Class Codes: B60R 1/12 Mirror assemblies combined with other articles, e.g. clocks
• CPC Class Codes: H05K 1/0286 Programmable, customizable or modifiable circuits by programmable non-printed jumper connections H05K3/222
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/09963 Programming circuit by using small elements, e.g. small PCBs
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1453 Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 2203/168 Wrong mounting prevention
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps:

• • manufacturing a plurality of substrate parts (2a, 2b); and
  • selecting at least two of the substrate parts (2a, 2b), and
  • connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Claims

1. A method for manufacturing a printed circuit board for a rear view device of a motor vehicle, the method comprising:

manufacturing a plurality of substrate parts;

selecting and connecting at least two of the substrate parts; and

providing the connected substrate parts with a circuit.

2. The method according to claim 1, wherein the substrate parts are formed from plastic or from ceramics.

3. The method according to claim 2, wherein the substrate parts are formed from plastic substrate parts in an injection moulding process.

4. The method according to claim 3, wherein the substrate parts are formed as standardized components, the standardized components having at least two different forms.

5. The method according to claim 1, wherein a first substrate part is connected to at least a second substrate part through at least one coupling means selected from frictional connection, double friction surfaces, positive locking, complementary keyed portions, adhesive force, or laser welding.

6. The method according to claim 5, wherein first substrate parts are each formed with at least one coupling means and second substrate parts are each formed with at least one receiving means to receive a coupling means of a first substrate part.

7. The method according to one claim 1, wherein the circuit is applied to the substrate through a film, a coating, a selective metallisation and/or laser direct structuring.

8. The method according to claim 1, wherein for standard components, the substrate parts to be connected are selected depending on the number of standard components of each form and on the circuit.

9. A printed circuit board manufactured according to claim 1.

10. A printed circuit board manufactured according to claim 4.

11. A printed circuit board manufactured according to claim 6.

12. A rear view device for a vehicle, comprising:

a housing;

at least one printed circuit board according to claim 9;

at least one electrical load operatively interacting with the printed circuit board, and

at least one power supply operatively interacting with the printed circuit board.

13. The rear view device according to claim 8, wherein the electrical load is at least one load selected from a lamp, a sensor, a camera, a motor, a heater and/or a control unit.