Packages with Interposers and Methods for Forming the Same

  • US 20150048503A1
  • Filed: 08/16/2013
  • Published: 02/19/2015
  • Est. Priority Date: 08/16/2013
  • Status: Active Grant
First Claim
Patent Images

1. A package structure comprising:

  • an interposer;

    a die over and bonded to the interposer; and

    a Printed Circuit Board (PCB) underlying and bonded to the interposer.

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