IMAGING SYSTEMS WITH STACKED IMAGE SENSORS
First Claim
1. An imaging system, comprising:
- a first image sensor having a first plurality of photodiodes; and
a second image sensor having a second plurality of photodiodes, wherein the first image sensor is stacked on top of and bonded to the second image sensor.
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Accused Products
Abstract
An imaging system may include a first image sensor die stacked on top of a second image sensor die. A pixel array may include first pixels having photodiodes in the first image sensor die and second pixels having photodiodes in the second image sensor die. The first pixels may be optimized to detect a first type of electromagnetic radiation (e.g., visible light), whereas the second pixels may be optimized to detect a second type of electromagnetic radiation (e.g., infrared light). Light guide channels may be formed in the first image sensor die to help guide incident light to the photodiodes in the second image sensor substrate. The first and second image sensor dies may be bonded at a wafer level. A first image sensor wafer may be a backside illumination image sensor wafer and a second image sensor wafer may be a front or backside illumination image sensor wafer.
47 Citations
27 Claims
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1. An imaging system, comprising:
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a first image sensor having a first plurality of photodiodes; and a second image sensor having a second plurality of photodiodes, wherein the first image sensor is stacked on top of and bonded to the second image sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An imaging system, comprising:
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a first image sensor wafer having a plurality of first image sensors; and a second image sensor wafer having a plurality of second image sensors, wherein the first image sensor wafer is stacked on top of and bonded to the second image sensor wafer and wherein each of the first image sensors is aligned with and electrically coupled to an associated one of the second image sensors. - View Dependent Claims (16, 17, 18, 19)
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20. An imaging system, comprising:
a pixel array having infrared imaging pixels and visible imaging pixels, wherein the visible imaging pixels each include a photodiode formed in a first semiconductor substrate, wherein the infrared imaging pixels each include a photodiode formed in a second semiconductor substrate, and wherein the first semiconductor substrate overlaps and is mounted to the second semiconductor substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
Specification