METHODS AND APPARATUSES FOR GENERATING PATTERNS ON WORKPIECES

• US 20150082620A1
• Filed: 12/02/2014
• Published: 03/26/2015
• Est. Priority Date: 09/15/2010
• Status: Active Grant

• Current Assignee: MRSI Systems, LLC (Mycronic AB)
• Original Assignee: Mycronic AB
• Inventors: GUSTAFSSON, Per-Erik, WAHLSTEN, Mikael
• Granted Patent: US 9,648,795 B2
• Time in Patent Office: Days
• US Class Current: 29/714
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H05K 13/0404 Pick-and-place heads or apparatus, e.g. with jaws
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble
• CPC Class Codes: Y10T 29/53061 Responsive to work or work-related machine element
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

Claims

1. (canceled)

2. A pick-and-place tool comprising:

a mounting head including,

a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece, the actual position of the at least one die being an actual position of the at least one die on the workpiece relative to at least one local alignment mark associated with or connected to a position on the workpiece, wherein

the mounting head includes the die position determining unit and is configured to move together with the die position determining unit between a first position at which the at least one die is picked up and a second position at which the at least one die is placed on the workpiece, and wherein

the pick-and-place tool is further configured to output position information indicative of the measured actual position to an external unit, either directly or indirectly via a memory, and wherein the position information is usable in adjusting original pattern data associated with a pattern to be generated on the workpiece.

3. The pick-and-place tool of claim 2, wherein the die position determining unit is configured to one of measure and detect the actual position of the at least one die while the mounting head is still in a position for placing the at least one die on the workpiece.

4. The pick-and-place tool of claim 2, wherein the pick-and-place tool is configured to measure the actual position of the at least one die on the workpiece relative to at least one measurement mark.

5. The pick-and-place tool of claim 4, wherein the at least one measurement mark is a local alignment mark or another unique feature associated with or connected to a position on the workpiece.

6. The pick-and-place tool of claim 5, wherein the pick-and-place tool is configured to output position information indicative of the actual position of the at least one die, and wherein the position information includes a measurement of the position of the at least one die relative to the local alignment mark or some other reference point to which the local alignment mark have a clearly defined distance.

7. The pick-and-place tool of claim 6, wherein the at least one die or component is placed on a first layer, and a pattern generator uses the position information to adjust original pattern data to be written on a second layer, which is different from the first layer.

8. The pick-and-place tool of claim 7, wherein both the first layer and the second layer are layers associated with the same group of placed dies or components.

9. The pick-and-place tool of claim 7, wherein the first layer is a layer associated with a first group of placed dies or components and the second layer is a layer associated with a second group of placed dies or components different from the first group of dies or components.

10. The pick-and-place tool of claim 2, wherein the die position determining unit includes a camera configured to obtain an image of the workpiece.

11. The pick-and-place tool of claim 10, wherein the camera is a charge coupled device camera.

12. The pick-and-place tool of claim 2, wherein the die position determining unit includes a sensor configured to detect a position of the at least one die on the workpiece.

13. The pick-and-place tool of claim 12, wherein the sensor is a laser sensor configured to use at least one of reflected light and triangulation to detect the position of the at least one die on the workpiece.

14. The pick-and-place tool of claim 10, wherein the camera is configured to obtain an image covering only a subarea of the workpiece surface area in order to measure the actual position of at least one die placed on the workpiece relative to at least one measurement mark.

15. The pick-and-place tool of claim 14, wherein the image obtained by the camera includes actual position information for only a subset of the plurality of dies placed on the workpiece.