Low Profile Sensor Package With Cooling Feature And Method Of Making Same

• US 20150084148A1
• Filed: 09/22/2014
• Published: 03/26/2015
• Est. Priority Date: 09/24/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Granted Patent: US 9,461,190 B2
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052

Abstract

A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.

Claims

1. A sensor device, comprising:

a silicon substrate with opposing first and second surfaces;

a sensor formed at or in the first surface;

a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor; and

a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface.

2. The device of claim 1, further comprising:

one or more second trenches formed into the first surface; and

a plurality of conductive traces each extending from one of the first contact pads and into the one or more second trenches.

3. The device of claim 1, wherein the sensor comprises a plurality of photo detectors.

4. The device of claim 1, further comprising:

a second substrate with opposing first and second surfaces, wherein the second surface of the silicon substrate is mounted to the first surface of the second substrate;

a plurality of second contact pads disposed at the first surface of the second substrate;

a plurality of electrical leads extending through the second substrate and electrically coupled to the plurality of second contact pads;

a plurality of wires each extending from one of the first contact pads to one of the second contact pads.

5. The device of claim 4, further comprising:

a thermally conductive material disposed between the second surface of the silicon substrate and the first surface of the second substrate

6. The device of claim 4, further comprising:

a plurality of heat conducting pads disposed at the first surface of the second substrate; and

a plurality of heat conducting leads extending through the second substrate and coupled to the plurality of heat conducting pads.

7. The device of claim 4, further comprising:

a portion of the first surface of the second substrate is recessed to define a cavity, wherein the silicon substrate is at least partially disposed in the cavity.

8. The device of claim 7, wherein the plurality of second contact pads is disposed at the recessed portion of the first surface of the second substrate, and wherein the wires are disposed in the cavity.

9. The device of claim 1, further comprising:

one or more heat pipes disposed in the cooling channels.

10. The device of claim 9, further comprising:

heat conductive material disposed in the cooling channels and between the silicon substrate and the one or more heat pipes.

11. A sensor device, comprising:

a silicon substrate with opposing first and second surfaces;

a sensor formed at or in the first surface;

a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor;

a second substrate with opposing first and second surfaces, wherein the second surface of the silicon substrate is mounted to the first surface of the second substrate; and

a plurality of cooling channels formed as first trenches extending into one of the first and second surfaces of the second substrate but not reaching the other of the first and second surfaces of the second substrate.

12. The device of claim 11, further comprising:

a second plurality of cooling channels formed as second trenches extending into the other of the first and second surfaces of the second substrate.

13. The device of claim 11, further comprising:

a thermally conductive material disposed between the second surface of the silicon substrate and the first surface of the second substrate.

14. The device of claim 11, further comprising:

a thermal electric heat pump disposed between the second surface of the silicon substrate and the first surface of the second substrate.

15. The device of claim 11, further comprising:

a third substrate with opposing first and second surfaces, wherein the second surface of the second substrate is mounted to the first surface of the third substrate; and

a second plurality of cooling channels formed as second trenches extending into one of the first and second surfaces of the third substrate but not reaching the other of the first and second surfaces of the third substrate.

16. The device of claim 11, further comprising:

a third substrate with opposing first and second surfaces, wherein the second surface of the second substrate is mounted to the first surface of the third substrate;

a plurality of second contact pads disposed at the first surface of the third substrate;

a plurality of electrical leads extending through the third substrate and electrically coupled to the plurality of second contact pads; and

a plurality of wires each extending from one of the first contact pads to one of the second contact pads.

17. The device of claim 16, further comprising:

a portion of the first surface of the third substrate is recessed to define a cavity, wherein the silicon substrate is at least partially disposed in the cavity.

18. The device of claim 11, further comprising:

one or more heat pipes disposed in the cooling channels.

19. A method of forming a sensor device, comprising:

providing a silicon substrate with opposing first and second surfaces;

forming a sensor at or in the first surface;

forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor; and

forming a plurality of cooling channels as first trenches extending into the second surface but not reaching the first surface.

20. The method of claim 19, further comprising:

forming one or more second trenches into the first surface; and

forming a plurality of conductive traces each extending from one of the first contact pads and into the one or more second trenches.

21. The method of claim 19, further comprising:

mounting a second substrate to the silicon substrate, wherein the second substrate includes;

opposing first and second surfaces;

a plurality of second contact pads disposed at the first surface of the second substrate;

a plurality of electrical leads extending through the second substrate and electrically coupled to the plurality of second contact pads;

wherein the mounting includes mounting the second surface of the silicon substrate to the first surface of the second substrate; and

connecting a plurality of wires each between one of the first contact pads and one of the second contact pads.

22. The method of claim 19, further comprising:

mounting one or more heat pipes in the cooling channels.

23. A method of forming a sensor device, comprising:

providing a silicon substrate with opposing first and second surfaces;

forming a sensor at or in the first surface;

forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor;

providing a second substrate with opposing first and second surfaces;

forming a plurality of cooling channels as first trenches extending into one of the first and second surfaces of the second substrate but not reaching the other of the first and second surfaces of the second substrate; and

mounting the second surface of the silicon substrate to the first surface of the second substrate.

24. The method of claim 23, further comprising:

forming a second plurality of cooling channels as second trenches extending into the other of the first and second surfaces of the second substrate.

25. The method of claim 23, further comprising:

mounting a thermal electric heat pump between the second surface of the silicon substrate and the first surface of the second substrate.

26. The method of claim 23, further comprising:

providing a third substrate with opposing first and second surfaces;

forming a second plurality of cooling channels as second trenches extending into one of the first and second surfaces of the third substrate but not reaching the other of the first and second surfaces of the third substrate; and

mounting the second surface of the second substrate to the first surface of the third substrate.

27. The method of claim 23, further comprising:

mounting a third substrate to the second substrate, wherein the third substrate includes;

opposing first and second surfaces;

a plurality of second contact pads disposed at the first surface of the third substrate;

a plurality of electrical leads extending through the third substrate and electrically coupled to the plurality of second contact pads;

wherein the mounting includes mounting the second surface of the second substrate to the first surface of the third substrate; and

connecting a plurality of wires each between one of the first contact pads and one of the second contact pads.