COOLING ASSEMBLY USING HEATSPREADER
First Claim
Patent Images
1. A microchip die cooling assembly comprising:
- a circuit board;
a microchip having an exposed die attached to the circuit board;
a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip;
a heat sink having a bottom side and a top side comprising a cooling structure;
a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader;
a second thermal interface material in contact with the top side of the heat spreader and the bottomside of the heat sink;
a pin securing the heatspreader to the circuit board; and
a spring connected to the pin to bias the heatspreader against the chip die.
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Accused Products
Abstract
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink.
32 Citations
18 Claims
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1. A microchip die cooling assembly comprising:
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a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; a second thermal interface material in contact with the top side of the heat spreader and the bottomside of the heat sink; a pin securing the heatspreader to the circuit board; and a spring connected to the pin to bias the heatspreader against the chip die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of assembling a die cooling device, comprising the steps of:
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attaching a chip having an exposed die to a circuit board; applying a first thermal interface material to the die; attaching a heatspreader to the die via the first thermal interface material; applying a second thermal interface material to the heatspreader; and attaching a heat sink to the heatspreader via the second thermal interface material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A heatspreader for use in an assembly for cooling a microchip with an exposed chip die, comprising:
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a body that formed from a thermally conductive material; a planar bottom surface having an area significantly greater than the area of the exposed chip die for thermally connecting to the exposed chip die; a planar top surface having an area equal to the area of the planar bottom surface; and two mounting features disposed in opposition in a plane parallel to the bottom surface for mounting the heatspreader in a resiliently biased thermal connection with the exposed chip die, wherein the resilient biased thermal connection includes a pin and spring to bias the heatspreader. - View Dependent Claims (18)
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Specification