Solder Alloy

  • US 20150086263A1
  • Filed: 04/17/2013
  • Published: 03/26/2015
  • Est. Priority Date: 04/18/2012
  • Status: Active Grant
First Claim
Patent Images

1. A solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn.

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