ULTRA-CAPACITOR STRUCTURES AND ELECTRONIC SYSTEMS WITH ULTRA-CAPACITOR STRUCTURES

• US 20150092343A1
• Filed: 09/15/2014
• Published: 04/02/2015
• Est. Priority Date: 09/30/2013
• Status: Active Grant

• Current Assignee: The Paper Battery Company, Inc.
• Original Assignee: The Paper Battery Company, Inc.
• Inventors: RICH, Dave, MEHTA, Shreefal Sudhir, SUDANO, Anthony, KULKARNI, Sudhir Rajaram, TRIFILO, Staci
• Granted Patent: US 9,583,277 B2
• Time in Patent Office: Days
• US Class Current: 361/679.54
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/10 Multiple hybrid or EDL capacitors, e.g. arrays or modules housings, cases, encapsulations or mountings thereof H01G11/78
• CPC Class Codes: H01G 11/14 Arrangements or processes for adjusting or protecting hybrid or EDL capacitors emergency protective circuit arrangements specially adapted for capacitors, and effecting automatic switching in the event of an undesired change from normal working conditions H02H7/16; emergency protective circuit arrangements for limiting excess current or voltages without disconnection H02H9/00
• CPC Class Codes: H01G 11/18 against thermal overloads, e.g. heating, cooling or ventilating
• CPC Class Codes: H01G 11/72 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 17/00 Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations
• CPC Class Codes: H02J 7/342 The other DC source being a battery actively interacting with the first one, i.e. battery to battery charging with circuits for polarity protection H02J7/0034
• CPC Class Codes: H02J 7/345 using capacitors as storage or buffering devices
• CPC Class Codes: H04R 1/1008 Earpieces of the supra-aural or circum-aural type
• CPC Class Codes: H04R 1/105 Earpiece supports, e.g. ear hooks for stereophonic headphones H04R5/0335
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

Ultra-capacitor structures and electronic systems and assemblies are provided. In one aspect, the ultra-capacitor structure is configured to selectively power and at least partially house electronic component(s) therein. In one embodiment, the ultra-capacitor structure includes a thermally conductive material facilitating dissipation of heat generated. In another embodiment, the ultra-capacitor structure includes an electrically conductive sheet facilitating electromagnetic shielding. In another aspect, an electronic system includes: an electronic device including electronic component(s); and a support structure physically receiving and electrically coupling to the electronic device, and including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic device when electrically coupled to the support structure. In another aspect, an electronic assembly has a first region including electronic component(s), and a second region including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic assembly, where the first region is spaced apart from the second region.

Claims

1. A structure comprising:

an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power and at least partially house one or more electronic components therein.

2. The structure of claim 1, further comprising a thermally conductive material, the thermally conductive material facilitating dissipation of heat generated by the one or more electronic components at least partially housed within the ultra-capacitor structure.

3. The structure of claim 2, wherein the thermally conductive material comprises one or more electrodes of the ultra-capacitor structure.

4. The structure of claim 1, further comprising an electrically conductive sheet, the electrically conductive sheet facilitating electromagnetic shielding of the one or more electronic components at least partially housed within the ultra-capacitor structure.

5. The structure of claim 4, wherein the electrically conductive sheet comprises a current collector of the ultra-capacitor structure.

6. The structure of claim 1, wherein the ultra-capacitor structure comprises a shock absorbent material at least partially surrounding the one or more electronic components housed within the ultra-capacitor structure, the shock absorbent material facilitating impact protection thereof.

7. The structure of claim 1, wherein the ultra-capacitor structure comprises multiple layers, and the one or more electronic components are positioned between the multiple layers of the ultra-capacitor structure.

8. The structure of claim 1, further comprising a printed circuit board, the printed circuit board capable of mechanically supporting and electrically connecting the one or more electronic components and the ultra-capacitor structure.

9. The structure of claim 1, further comprising a battery, the battery capable of charging the ultra-capacitor structure thereof.

10. The structure of claim 1, wherein the ultra-capacitor structure comprises multiple ultra-capacitor cells.

11. The structure of claim 1, wherein the ultra-capacitor structure comprises at least one bendable portion, the at least one bendable portion facilitating the ultra-capacitor structure bending around to at least partially house the one or more electronic components within the ultra-capacitor structure.

12. The structure of claim 11, wherein the ultra-capacitor structure comprises a thermally conductive material, the thermally conductive material facilitating dissipation of heat generated by the one or more electronic components at least partially housed within the ultra-capacitor structure.

13. The structure of claim 11, wherein the ultra-capacitor structure comprises an electrically conductive sheet, the electrically conductive sheet facilitating electromagnetic shielding of the one or more electronic components at least partially housed within the ultra-capacitor structure.

14. The structure of claim 11, wherein the ultra-capacitor structure comprises a shock absorbent material at least partially surrounding the one or more electronic components housed within the ultra-capacitor structure, the shock absorbent material facilitating impact protection thereof.

15. An electronic system comprising:

one or more electronic components; and

an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power and at least partially house the one or more electronic components therein.

16. The electronic system of claim 15, wherein the ultra-capacitor structure at least partially forms an outer shell of the electronic system.

17. The electronic system of claim 15, wherein the electronic system comprises a mobile device, and the ultra-capacitor structure forms at least a partial outer housing of the mobile device to house the one or more electronic components therein.

18. The electronic system of claim 15, wherein the ultra-capacitor structure comprises at least one bendable portion, the at least one bendable portion facilitating the ultra-capacitor structure bending around to at least partially house the one or more electronic components.

19. The electronic system of claim 15, wherein the ultra-capacitor structure comprises a thermally conductive material, the thermally conductive material facilitating dissipation of heat generated by the one or more electronic components at least partially housed within the ultra-capacitor structure.

20. The electronic system of claim 15, wherein the ultra-capacitor structure comprises an electrically conductive sheet, the electrically conductive sheet facilitating electromagnetic shielding of the one or more electronic components at least partially housed within the ultra-capacitor structure.

21. An electronic system comprising:

an electronic device, the electronic device comprising one or more electronic components; and

a support structure, the support structure physically receiving and electrically coupling to the electronic device, and comprising an ultra-capacitor structure, wherein the ultra-capacitor structure is configured to selectively power the one or more electronic components of the electronic device when electrically coupled to the support structure.

22. The electronic system of claim 21, wherein a bendable portion of the ultra-capacitor structure facilitates bending of the support structure.

23. An electronic assembly comprising:

a first region, the first region comprising one or more electronic components; and

a second region, the second region comprising an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power the one or more electronic components of the electronic assembly, wherein the first region is spaced apart from the second region.

24. The electronic assembly of claim 23, wherein the first region is smaller than the second region.

25. The electronic assembly of claim 23, wherein the electronic assembly is an audio headset device, and the second region comprises a headband portion thereof, wherein the ultra-capacitor structure comprises a curved portion of the headband portion of the audio headset device.